The operation of thin-film electronic devices is dictated by the band alignment at the interfaces of the various layers. While a number of methods for measuring the depth profile of the electrical potential at interfaces have emerged, these are typically arduous to perform and involve the use of ultra-high vacuum, complicated sample preparation and/or suffer from poor resolution. Here we present a method to directly map the depth profile of the electrical potential at an interface in air by growing a sample with an intentional thickness gradient and correlating the surface potential, measured using (macroscale) scanning Kelvin probe, to the thickness at each point. Our approach is non-destructive and rapid, is ideal for large substrates and films grown with an inherent thickness gradient. It enjoys very high depth (2 nm) and energy resolution (5 meV), comparable to other methods. In this work we develop and demonstrate the method on layer.