Crosstalk between microstrip transmission lines

Cavcey, Kenneth H.; Johnk, Robert T.

doi:10.1109/15.328861

Cited by 67 publications

(32 citation statements)

References 15 publications

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“…Similar dips were also observed in the high-resistivity case [19] when m. The maximum value of coupling is around 30 dB at approximately 45 GHz and this is also in agreement with the high-case. This behavior (nonmonotonic increase) observed in the forward coupling for both highand low-silicon wafers is not similar to results presented in literature for coupled transmission lines such as microstrips [15], [21]. In this case, it is believed that the forward and backward coupling when is due to indirect coupling, as described by Schelkunoff and Odarenko [22].…”

Section: Measured Resultscontrasting

confidence: 53%

Crosstalk Between Finite Ground Coplanar Waveguides Over Polyimide Layers for 3-D MMICs on Si Substrates

Papapolymerou

Ponchak

Dalton

et al. 2004

IEEE Trans. Microwave Theory Techn.

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Abstract-Finite-ground coplanar (FGC) waveguide lines on top of polyimide layers are frequently used to construct three-dimensional Si-SiGe monolithic microwave/millimeter-wave integrated circuits on silicon substrates. Requirements for high-density, low-cost, and compact RF front ends on silicon can lead, however, to high crosstalk between FGC lines and overall circuit performance degradation. This paper presents theoretical and experimental results and associated design guidelines for FGC line coupling on both high-and low-resistivity silicon wafers with a polyimide overlay. It is shown that a gap as small as 6 m between two adjacent FGC lines can reduce crosstalk by at least 10 dB, that the nature of the coupling mechanism is not the same as with microstrip lines on polyimide layers, and that the coupling is not dependent on the Si resistivity. With careful layout design, isolation values of better than 30 dB can be achieved up to very high frequencies (50 GHz).Index Terms-Coplanar waveguide (CPW), coupling, crosstalk, finite difference time domain (FDTD), finite ground coplanar (FGC) waveguide, monolithic microwave integrated circuit (MMIC), polyimide.

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Section: Measured Resultscontrasting

confidence: 53%

Crosstalk Between Finite Ground Coplanar Waveguides Over Polyimide Layers for 3-D MMICs on Si Substrates

Papapolymerou

Ponchak

Dalton

et al. 2004

IEEE Trans. Microwave Theory Techn.

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“…Both methods are in good agreement at the lower frequencies. The decreasing amplitude of the maxima in S 13 for increasing frequency is also present in the measurement [14] but not in the momentum simulation. This is probably due to the fact that coupled ports were used in momentum.…”

Section: Numerical Resultsmentioning

confidence: 72%

FastS-parameter extraction method for the analysis of planar structures using the method of moments

Thielen

Vandenbosch

2001

Int J RF and Microwave Comp Aid Eng

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This article describes a new fast method that yields an S-parameter's description for a structure immediately after solving the method of moments (MoM) matrix. A virtual elongation is added to the line without extra coupling calculations. The line can be excited by imposing traveling waves with the correct propagation constant and current profile on this elongation. The elongation is also used to modify the line's self-coupling matrix (without changing its size) to make it appear as though it is terminated in a matched load at its fed end. The described method allows a close integration between the method of moments and S-parameter circuit solvers.

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“…Given a solution to this equation, the E field can be computed using Equation (3) and then the D field computed using Equation (2). At this point, all of the fields surrounding the device are known, can be visualized, and can be used to calculate the transmission line parameters.…”

Section: Governing Equationsmentioning

confidence: 99%

“…More functions can be fit into the same amount of space, products with novel form factors can be more easily manufactured, interconnect can be routed more smoothly, interfaces can be better implemented, electrical and mechanical functions can be comingled, and entirely new device paradigms will be invented. When we depart from traditional planar topologies, however, many new problems arise like signal integrity, crosstalk, noise, and unintentional coupling between devices [2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Isolation of a Microstrip by Embedding in a Spatially Variant Anisotropic Metamaterial

Rumpf¹,

Garcia

Tsang

et al. 2013

PIER

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Abstract-The near-field surrounding devices can be arbitrarily sculpted if they are embedded in a spatially variant anisotropic metamaterial (SVAM). Our SVAMs are low loss because they do not contain metals and are extraordinarily broadband, working from DC up to a cutoff. In the present work, a microstrip transmission line was isolated from a metal object placed in close proximity by embedding it in a SVAM so that the field avoided the object. Our paper begins by outlining a simple model for studying transmission lines embedded in SVAMs. We then present our design and experimental results to confirm the concept.

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Crosstalk between microstrip transmission lines

Cited by 67 publications

References 15 publications

Crosstalk Between Finite Ground Coplanar Waveguides Over Polyimide Layers for 3-D MMICs on Si Substrates

Crosstalk Between Finite Ground Coplanar Waveguides Over Polyimide Layers for 3-D MMICs on Si Substrates

FastS-parameter extraction method for the analysis of planar structures using the method of moments

Electromagnetic Isolation of a Microstrip by Embedding in a Spatially Variant Anisotropic Metamaterial

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