2008 Chinese Control and Decision Conference 2008
DOI: 10.1109/ccdc.2008.4597985
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Crosstalk noise analysis for distributed parameter high-speed interconnect lines based on the transfer function

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“…The application of DSM (Deep Submicron) technologies in manufacturing leads to the increase of parasitic coupling capacitance and inductance among geometrically adjacent lines which will make the signal integrity-related failures unnegligible [1][2][3]. With nanometer technology and clock frequencies in GHz range, the signal integrity problems turn even more serious and directly influence the correctness and reliability of SoC (System on a Chip) function [4][5][6].…”
Section: Introductionmentioning
confidence: 99%
“…The application of DSM (Deep Submicron) technologies in manufacturing leads to the increase of parasitic coupling capacitance and inductance among geometrically adjacent lines which will make the signal integrity-related failures unnegligible [1][2][3]. With nanometer technology and clock frequencies in GHz range, the signal integrity problems turn even more serious and directly influence the correctness and reliability of SoC (System on a Chip) function [4][5][6].…”
Section: Introductionmentioning
confidence: 99%