2016 IEEE International Electron Devices Meeting (IEDM) 2016
DOI: 10.1109/iedm.2016.7838410
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Cryo-CMOS for quantum computing

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Cited by 208 publications
(94 citation statements)
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“…The additional power consumed by the FET at deep-cryogenic temperatures as a result of ∆SS is crucial for the desired scalability of quantum computers that is expected from co-integration of spin qubits in Si with FET-based control circuits. [23][24][25][26][27][28][29][30][31][32][33][34] a) Electronic mail: arnout.beckers@epfl.ch…”
Section: Introductionmentioning
confidence: 99%
“…The additional power consumed by the FET at deep-cryogenic temperatures as a result of ∆SS is crucial for the desired scalability of quantum computers that is expected from co-integration of spin qubits in Si with FET-based control circuits. [23][24][25][26][27][28][29][30][31][32][33][34] a) Electronic mail: arnout.beckers@epfl.ch…”
Section: Introductionmentioning
confidence: 99%
“…For single-ended N-stages CMOS ring oscillators, assuming that the thermal noise sources of every inverter are uncorrelated and that the waveform (hence the ISF) of all nodes are the same except for a phase-shift, the total phase noise is N times the value given by (1). Taking only these inevitable noise sources into account, the expression for phase noise is given by [6]:…”
Section: Circuit Descriptionmentioning
confidence: 99%
“…With the development of quantum computing, the wiring requirements between the cryogenic quantum processor and the room temperature (RT) read-out controller can be both expensive and unreliable [1]. As an alternative, a cryogenic electronic interface that consists of control, interaction and read-out stages has been proposed.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, hardware interfaces based on advanced CMOS technologies that operate at cryogenic temperature so as to ensure proximity to qubits have been proposed and discussed [6][7][8][9]. Bulk Si MOSFET [10][11][12][13] and other basic circuits such as Ring Oscillators (ROs) [11] and an FPGA (Field-Programmable Gate Array) [14] were characterized down to H. Bohuslavskyi 4K. Despite a significant reduction of subthreshold swing (SS) and improvement of carrier mobility at low temperature, some limitations have been raised on bulk Si technologies.…”
Section: Introductionmentioning
confidence: 99%