Cryogenic/sub-ambient cooling of electronics: revisited

Suman, Shivesh K.; Fedorov, Andrei G.; Joshi, Yogendra

doi:10.1109/itherm.2004.1319178

Cited by 5 publications

(4 citation statements)

References 19 publications

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“…Suman et al [9] used a simple thermal resistance correlation to compare different cryogenic cooling technologies for electronics: a Linde air cycle, a Stirling cycle, a vapor compression refrigeration (VCR) cycle, a cascaded vapor compression refrigeration cycle, a vortex tube, and a liquid nitrogen system. The thermal resistance equation showed that the coefficient of performance (COP) of the vapor compression refrigeration cycle decreased with a decrease in junction temperature.…”

Section: Literature Reviewmentioning

confidence: 99%

Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling

Trutassanawin

Groll

Garimella

et al. 2006

IEEE Trans. Comp. Packag. Technol.

108

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A miniature-scale refrigeration system suitable for electronics cooling applications was developed and experimentally investigated. A detailed review of the literature on refrigeration systems and system simulation models for application to electronics cooling is also provided. Experimental results obtained with the prototype system demonstrate its feasibility for use in cooling compact electronic devices. The cooling capacity of the system investigated varied from 121 to 268 W, with a COP of 2.8 to 4.7, at pressure ratios of 1.9 to 3.2. The effectiveness of the condenser ranged from 59 to 77%, while a thermal resistance of 0.60 and 0.77 ºC-cm 2 /W was achieved at the evaporator. The evaporator-heat spreader thermal resistance is defined as the ratio of the temperature difference between the chip surface and the refrigerant evaporator to the evaporator heat transfer rate.The overall system thermal resistance, defined as the ratio of the temperature difference between the chip surface and the condenser air inlet, is of 0.04 to 0.18 ºC-cm 2 /W. An overall second-law efficiency ranging from 33 and 52% was obtained, using a commercially available small-scale compressor. The measured overall isentropic efficiency was between 40 and 60%.Index Terms-Miniature-scale refrigeration system, electronics cooling, small-scale compressor, second-law efficiency,

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Section: Literature Reviewmentioning

confidence: 99%

Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling

Trutassanawin

Groll

Garimella

et al. 2006

IEEE Trans. Comp. Packag. Technol.

108

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“…Active systems driven by a compressor, refrigeration/heat pump systems, offer a further increase in heat removal by insertion of a negative thermal resistance into heat flow path [9]. Among the different candidate technologies, absorption refrigeration offers the compactness, relative ease of scalability to varying cooling load, and relatively high coefficient of performance (COP) (assuming waste heat is available), making it an attractive option for cooling of high power, high performance electronics [12]. In places where an excess of heat of sufficient quality is available, absorption refrigeration offers an opportunity to recycle the thermal energy, which would otherwise be wasted.…”

Section: Introductionmentioning

confidence: 99%

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Kim

Joshi³

et al. 2012

Journal of Electronic Packaging

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The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption heat pump system for possible applications in electronics thermal management. A significant amount of the energy consumed in large electronic systems is used for cooling, resulting in low grade waste heat, which can be used to drive an absorption refrigeration system if a suitable working fluids can be identified. The Redlich–Kwong-type equation of state was used to model the thermodynamic conditions and the binary mixture properties at the corresponding states. The effects of desorber and absorber temperatures, waste-heat quality, and system design on the heat pump performance were investigated. Supporting experiments using R134a/(bmim)(PF6) as the working fluid pair were performed. Desorber and absorber outlet temperatures were varied by adjusting the desorber supply power and the coolant temperature at the evaporator inlet, respectively. For an evaporator temperature of 41 °C, which is relevant to electronics cooling applications, the maximum cooling-to-total-energy input was 0.35 with the evaporator cooling capability of 36 W and the desorber outlet temperature in the range of 50 to 110 °C.

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“…Among different candidate technologies, the absorption refrigeration offers the compactness, relative ease of scalability to varying cooling load, and relatively high COP, making it an attractive option for cooling of high performance electronics (Suman et al, 2004). Specifically, such a system can be considered as one of the candidates for cooling of the CPU in desktop PCs and also as a wearable cooling system, e.g., for workers exposed to hazardous materials, police wearing body armor, and military personnel exposed to nuclear, biological or chemical warfare agents (Drost and Friedrich, 1997).…”

Section: Introductionmentioning

confidence: 99%