2020
DOI: 10.1016/j.precisioneng.2020.01.006
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Crystal anisotropy-dependent shear angle variation in orthogonal cutting of single crystalline copper

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Cited by 43 publications
(16 citation statements)
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“…However, the groove morphology and removal state can only be detected after processing and the material removal process could not be dynamically understood. Recently, Zhang et al used linear cutting tools directly connected in SEM to see the chip formation process in material cutting, while this method is complicated and SEM should be modified [ 76 ]. Thus, this method is difficult to be generalized.…”
Section: Analysis Of Simulation Resultsmentioning
confidence: 99%
“…However, the groove morphology and removal state can only be detected after processing and the material removal process could not be dynamically understood. Recently, Zhang et al used linear cutting tools directly connected in SEM to see the chip formation process in material cutting, while this method is complicated and SEM should be modified [ 76 ]. Thus, this method is difficult to be generalized.…”
Section: Analysis Of Simulation Resultsmentioning
confidence: 99%
“…Especially in micro/nano-cutting, the impact of crystal anisotropy on shear angle cannot be neglected, because the tool-workpiece normally interacts within a single crystal. Wang et al [28] demonstrated that the activated dislocation slip system in the primary deformation zone depends on the relative angle between the cutting direction and the crystal orientation. Thus, to address the crystal anisotropy, a modified shear angle equation is proposed in this study by incorporating Taylor factor (𝑀), which is normally used as an approximate measure of the relative direction of dislocation sliding activities to the crystal orientation, into Lee's shear angle equation as…”
Section: Calculation Of Flow Stress By Hybrid Slip-line Modelmentioning
confidence: 99%
“…More recently, Wang et al presents CPFE modeling and simulations of orthogonal diamond cutting of polycrystalline copper and corresponding experimental validation, in which the crystallographic orientations of individual grains between simulations and experiments are the same with electron backscatter diffraction (EBSD) characterization and corresponding Euler angles mapping [22,28]. They also demonstrated a strong dependence of shearing deformation of single crystalline copper under orthogonal cutting on crystal anisotropy by CPFE simulations and experimental validation [31]. To facilitate the fundamental understanding of the material anisotropy influence on cutting processes of crystalline materials, further theoretical and experimental work is greatly needed.…”
Section: Introductionmentioning
confidence: 99%