Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

“…However, fatigue damage originates at the microstructural length scale, initiating with slip activation and dislocation pile-up with the consequent stress concentrations at the intragranular scale (Gustafson et al, 2020;Jiang and Dasgupta, 2021). In relation to research on the damage mechanisms of individual solder joints, several continuum models (Darbandi et al, 2014;Jiang and Dasgupta, 2021;Zamiri et al, 2009) were developed for SAC alloys, but intermetallic size and morphology effects (along with crystallographic anisotropy) were not considered, and recently it has been observed that they strongly affect the creep behaviour of SAC305 alloy (Xu et al, 2021a) using a particle-hardening model (Li et al, 2020). Previous studies (Maleki et al, 2011(Maleki et al, , 2013 did not fully include the crystallographic elasto-plastic anisotropy for the Sn phase, which has been extensively considered as a major driver for damage development within solders (Bai and Chen, 2009;Gong et al, 2007;Zhou et al, 2015) or the scale coupling to BGA board (Mukherjee et al, 2016).…”

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

“…For slip systems of the slip motion, they are determined by β-Sn with the influence of the intermetallic compound (IMC) in Sn-rich solder ignored due to less abundant. Ten slip systems, which are relatively easy to occur in β-Sn, were adopted in our proposed model (Darbandi, 2014; Düzgün and Aytaş, 1993; Philippi et al., 2016). They are listed in Table 1.…”

“…Therefore, it is necessary to propose an anisotropic constitutive model that can describe the anisotropic performance of Sn-rich solder. Furthermore, this issue becomes more important as the anisotropic performance plays a significant role in the failure of solder bump, which contains only one or multi-grains with the miniaturization of electronic device (Bieler et al, 2008;Darbandi, 2014;Darbandi et al, 2012Darbandi et al, , 2014Qian and Chen, 2017). The anisotropy of Sn-rich solder is mainly caused by b-Sn, which is the main ingredient and has a body centered tetragonal (BCT) structure.…”

Effect of Aging Time on Deformation Behavior of Lead-Free and Lead Base Solders Alloys

“…Therefore, in order to develop a reliable model to predict the deformation behavior of lead-free solders, a comprehensive understanding of mechanical properties is required. Most of the prior studies focus on the tin anisotropy and the effect of this material characteristic on mechanical properties of leadfree solder joints and their behavior during mechanical deformation and thermal processes [7][8][9][10]. Comprehensive understanding of mechanical properties is required to develop a reliable model to predict the deformation behavior of lead-free solders [11][12][13].…”