The isothermal section at 800°C of the phase diagram of the ternary system Sc–Cu–Al was constructed in the whole concentration range using X-ray powder diffraction data. The existence of eight ternary compounds was confirmed: ScCu4.9‑6.0Al7.1‑6.0 (structure type ThMn12, Pearson symbol tI26, space group I4/mmm), Sc6Cu24.1Al11.9 (own structure type, cI176, Im-3), Sc2Cu6.25Al4.75 (own structure type, oS108, Cmmm), Sc3Cu7.5Al7.5 (Sc3Ni11Ge4, hP38, P63/mmc), ScCu2Al (MnCu2Al, cF16, Fm-3m), ScCu0.8Al0.2 (CsCl, cP2, Pm-3m), ScCu0.6Al1.4 (MgNi2, hP24, P63/mmc), and ScCuAl (MgZn2, hP12, P63/mmc), and the existence of a continuous solid solution ScCu1-xAlx (x = 0-1), based on the binary compounds ScCu and ScAl with CsCl-type structure (cP2, Pm-3m), was established. The investigation of the Ti–Cu–Al system at 800°C confirmed the existence of four ternary compounds: TiCu0.25Al2.75 (ZrAl3, tI16, I4/mmm), TiCu0.3-0.6Al2.7-2.4 (Cu3Au, cP4, Pm-3m), TiCu2-2.7Al1-0.3 (MnCu2Al, cF16, Fm-3m), and TiCu0.54-1.16All.46-0.84 (MgZn2, hP12, P63/mmc). Electrical resistivity measurements were performed for three compounds in the Sc–Cu–Al system and confirmed metal behavior in the temperature range 5-290 K.