2022
DOI: 10.1021/jacs.2c04868
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Crystallize It before It Diffuses: Kinetic Stabilization of Thin-Film Phosphorus-Rich Semiconductor CuP2

Abstract: Numerous phosphorus-rich metal phosphides containing both P–P bonds and metal–P bonds are known from the solid-state chemistry literature. A method to grow these materials in thin-film form would be desirable, as thin films are required in many applications and they are an ideal platform for high-throughput studies. In addition, the high density and smooth surfaces achievable in thin films are a significant advantage for characterization of transport and optical properties. Despite these benefits, there is har… Show more

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Cited by 8 publications
(31 citation statements)
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“…In general, phosphorus-rich phosphides have not been studied as potential PV materials before. They had hardly been grown in the thin-film form until a very recent report of single-phase CuP 2 films in the P 2 1 / c structure by reactive sputtering and soft annealing in an inert atmosphere …”
Section: Resultsmentioning
confidence: 99%
“…In general, phosphorus-rich phosphides have not been studied as potential PV materials before. They had hardly been grown in the thin-film form until a very recent report of single-phase CuP 2 films in the P 2 1 / c structure by reactive sputtering and soft annealing in an inert atmosphere …”
Section: Resultsmentioning
confidence: 99%
“…This possibility has allowed us to grow polycrystalline CuP 2 films by a two-step process. 12 Fourth, PH 3 assists the crystallization of Cu 3−x P even at room temperature, where films sputtered in pure Ar are amorphous (Figure 2). This effect is presumably caused by bombardment of the growing film by energetic species formed from the dissociation of PH 3 in an RF plasma.…”
Section: = + +mentioning
confidence: 99%
“…The steep increase in resistivity on the left side of the minimum is due to the much higher resistivity of CuP 2 (around 1 Ω cm) with respect to Cu 3−x P, as shown elsewhere. 12 On the right side of the minimum, the resistivity increases until the Cu 3.8 P composition is reached (Figure 5a). Since metallic Cu peaks begin to appear in XRD at a similar composition (Figure 1b), we assume that the resistivity increase is caused by changes in concentration of point defects up to the Cu precipitation threshold.…”
Section: Chemistry Of Materialsmentioning
confidence: 99%
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