Crystallographic texture and microtexture of copper drawn at 295 K and 77 K

Abstract

The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation they presented important and significant differences in their crystallographic textures and microstructures. Therefore, this study aimed to investigate the evolution of crystallographic texture of pure copper drawn at temperatures of 295 K and 77 K and correlated them to the deformation micromechanisms. For this, the X ray diffraction (XRD) and electron backscattered diffraction (EBSD) techniques were used. The results showed that, after the deformation, the samples drawn at both temperatures showed Copper {112}<111>, X {110}<111> and Brass {110}<112> components as the most intense. In samples drawn at cryogenic temperature there was also observed the appearance of a R{124}<211> component, typical of recrystallization and the presence of the  fiber {111}<uvw>, typical of deformation twin.

Comparative Study by Tem, Ebsd and Microhardness of the Microstructure of Copper Wiredrawn at 77 K and 295 K

“…Consequently, the possible presence of mechanical twinning in the cryogenic samples is consistent with the less dynamic recovery observed in this material on comparison to wire deformed at room temperature, that presented partially recrystallization as report by Carvalho et al [11].…”