“…Thus far, titanium-, glass-or ceramicbased enclosures have been the primary means for hermetic sealing in long-term implants, since these hard materials have been shown to be biocompatible and impermeable to water [181]. Even though such hard enclosures are used in the majority of long-term implants [6], [111], [122], [150]- [155], [159], [183], their very large volume and weight, typically much larger than the ICs and supporting components they contain, prohibits their use in high-dimensional neural interfaces heavily constrained by anatomical space such as retinal prostheses [184] and ECoG arrays [30]. In addition, hard packaging requires intricate methods for hermetic sealing of feedthroughs to polymer insulated extensions of the implant such as electrode array cabling, limiting the density of electrode channels due to feedthrough channel spacing requirements.…”