Cu micropatterning on n-Si(111) by selective electrochemical deposition using an agarose stamp

Rapid electrochemical synthesis of HKUST-1 on indium tin oxide

“…We electrodeposited a circular pattern of Cu with a diameter of 50 mm on ITO using an electrochemical wet stamping technique. 12 We observe HKUST-1 growth aer maintaining a potential of 1.5 V vs. SCE for 100 s. The inset of Fig. 2(f) shows that the octahedral crystal of HKUST-1 replaces the original Cu nanoparticles, as shown in the inset of Fig.…”

Preferential growth of Co3O4 anode material with improved cyclic stability for lithium-ion batteries

“…20 However, in the case of agarose-mediated electrodeposition, the agarose gel provides pathways for both electrons and Co 2+ ions. 21 The ions linearly and compulsorily migrate inside the gels because a linear electric eld is applied to the substrate, which plays a key role in the preferentially oriented growth. 10 Consequently, ions that are oriented in one direction (vertical to the substrate) will be reduced, leading to the nal formation of a vertically aligned Co(OH) 2 layer.…”

Recent Advancements in EMM for Micro and Nanofabrication

“…Fig. 12.16 shows arrays of concentric copper rings on n-Si [30]. E-WETS can also be applied to fabricate microstructures of conductive polymers, metal oxides, as well as other materials which are difficult to fabricate using established methods.…”

“…The control of electrode separation distance is very critical in EnFACE. Concentric copper rings on n-Si fabricated by electrochemical wet stamping [30].…”