Cu₃Sn suppression criterion for solid copper/molten tin reaction

Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder

“…The difference of copper concentrations C l/e -C l/g & 8.75 9 10 -3 in liquid tin between equilibrium with e-Cu 3 Sn and with g-Cu 6 Sn 5 phases is obtained from thermodynamic data [15,19,20]. With these data, Eq.…”

“…Recently, we estimated the critical thickness of g-phase, necessary for the growth of e-phase, as about 0.6-1 lm [15]. It should be also useful to see, how the presence or absence of one phase may influence the growth kinetics of another phase.…”

Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222 °C: Experimental results versus theoretical model calculations

“…is obtained from thermodynamic data [29,35,36] (detailed calculations are given in Appendix 2). All experimental and calculated data are summarized in Table 3 which also gives the calculated values of the diffusion coefficient of copper in liquid tin [38].…”

“…Calculated variation of the Gibbs free energy of formation of (Sn, Cu) liquid phase as a function molar fraction of Sn (c Sn ) as well as the Gibbs free energy of formation of e-Cu 3 Sn and g-Cu 6 Sn 5 compounds and pure solid and liquid Cu and Sn[23,29,35].…”