Cure behavior of an epoxy resin-dicyandiamide system accelerated by monuron

Laliberte, Bernard R.; Börnstein, J.; Sacher, Robert E.

doi:10.1021/i300010a019

Cited by 25 publications

(16 citation statements)

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“…It was interesting that the overall reaction order found with these three methods was almost constant (≅2.4). Our results were in agreement with the results of other authors8–14 who studied DICY‐cured epoxy resins. The E a values reported in the literature were in the range 75–100 kJ/mol.…”

Section: Resultssupporting

confidence: 93%

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Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

Hayaty

Beheshty

Esfandeh

2010

J of Applied Polymer Sci

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Dicyandiamide (DICY)-cured epoxy resins are important materials for structural adhesives and matrix resins for fiber-reinforced prepregs. Dynamic differential scanning calorimetry (DSC) with heating rates of 2.5, 5, 10, and 15 C/min was used to study the curing behavior of the epoxy prepreg Hexply 1454 system, which consisted of diglycidyl ether of bisphenol A, DICY, and Urone reinforced by glass fibers. The curing kinetic parameters were determined with three different methods and compared. These were the Kissinger, Ozawa, and Borchardt-Daniels kinetic approaches. The lowest activation energy (76.8 kJ/ mol) was obtained with the Kissinger method, whereas the highest value (87.9 kJ/mol) was obtained with the Borchardt-Daniels approach. The average pre-exponential factor varied from 0.0947 Â 10 9 to 2.60 Â 10 9 s À1. The orders of the cure reaction changed little with the heating rate, so the effect of the heating rate on the reaction order was not significant. It was interesting that the overall reaction order obtained from all three methods was nearly constant (%2.4). There was good agreement between all of the methods with the experimental data. However, the best agreement with the experimental data was seen with the Ozawa kinetic parameters, and the most deviation was seen with the Borchardt kinetic parameters. V C 2010 Wiley Periodicals, Inc. J Appl Polym Sci 120: [62][63][64][65][66][67][68][69] 2011

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Section: Resultssupporting

confidence: 93%

“…This prepreg was based on a dicyandiamide (DICY)‐cured diglycidyl ether of bisphenol A epoxy resin system. No cure kinetic parameters have been published for this advanced material, and only a few articles have been published on DICY‐cured epoxy resins 8–14. The experimental data were modeled by autocatalytic cure kinetics.…”

Section: Introductionmentioning

confidence: 99%

Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

Hayaty

Beheshty

Esfandeh

2010

J of Applied Polymer Sci

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“…LaLiberte et ai. 63) found that Monuron or Diuron could react with epoxide to form an oxazolidone and dimethylamine:…”

Section: Imentioning

confidence: 99%

The application of differential scanning calorimetry (DSC) to the study of epoxy resin curing reactions

Barton

1985

Advances in Polymer Science

271

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This review is on the use of difJerential scanning calorimetry as a method of monitoring and investigating the kinetics of epoxy resin turin9 reactions. Some instrumental and experimental aspects are discussed, includino methods of analysing the kinetic data. A brief survey is made of epoxy resin turin 9 reactions and results of DSC studies are reviewed. These results are concerned with the use of carboxylic acid anhydrides, primary and secondary amines, dicyanodiamide, and imidazotes as curing agents.

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“…In the second phase, the effect of DICY amount was studied (Table ) on previously optimized composition of DGEBAL‐PES‐13, since it is reported elsewhere that 1 mol DICY can react with 3–7 equiv of epoxy …”

Section: Resultsmentioning

confidence: 99%

Fabrication and evaluation of structural film adhesive using oxazolidinone modified novolac epoxy resin

Pal

Sudhi

Ramanan

2019

J of Applied Polymer Sci

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Epoxy film adhesives are of prime importance for the fabrication of lightweight honeycomb structures for aerospace industries. This work involves the synthesis of oxazolidinone modified epoxy novolac resin (EPN‐OXA) via the reaction of EPN and toluene diisocyanate. EPN‐OXA was characterized by Fourier transform infrared spectroscopy, nuclear magnetic resonance spectroscopy, gel permeation chromatography, and epoxy equivalent weight. EPN‐OXA was blended with solid epoxy resin, polyethersulfone (PES) toughened liquid epoxy resin, dicyandiamide, and aluminum powder to fabricate a film adhesive curing at 170–180 °C. Effect of additives and curative on the adhesive property was studied to optimize the composition. Effect of PES on the optimized composition was studied in detail. The best composition exhibited lap shear strength of 370 ± 10 kgf cm−2 at 25 °C and the strength was retained to 75% at −196 °C and 52% at 120 °C. PES significantly enhanced the interfacial strength at different temperatures (~1.6‐fold at −196 and 25 °C and ~1.8‐fold at 120 °C). It also improved tensile strength and fracture toughness by 1.4‐ and 2‐fold, respectively. The toughening effect of PES was further confirmed by scanning electron microscopy images. PES marginally reduced the glass‐transition temperature and it exhibited no effect on thermal stability. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47520.

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Cure behavior of an epoxy resin-dicyandiamide system accelerated by monuron

Cited by 25 publications

References 1 publication

Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

The application of differential scanning calorimetry (DSC) to the study of epoxy resin curing reactions

Fabrication and evaluation of structural film adhesive using oxazolidinone modified novolac epoxy resin

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