2003
DOI: 10.1016/s0032-3861(03)00296-9
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Cure kinetics and morphology of blends of epoxy resin with poly (ether ether ketone) containing pendant tertiary butyl groups

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Cited by 106 publications
(73 citation statements)
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“…However, their brittle nature due to its high cross-link density and poor resistance to crack propagation limits the applications in advanced aerospace structures. To overcome this problem various Engineering thermoplastics like polyether sulfone [2,3], polycarbonate [4,5], polyethylene tere phthalate [6,7], poly ether ether ketone/hydroxyl terminated poly (ether ether ketone) with pendant methyl groups (PEEKMOH) [8,9], Poly ether ether ketone/hydroxyl terminated poly ether ether ketone with pendant tertiary butyl groups [10][11][12][13] or poly (cyanoarylene ether)/hydroxyl terminated poly arylene ether nitrile with pendant tertiary butyl groups [14,15] have been used as a toughness modifiers for epoxy resin without sacrificing other thermomechanical properties. However no evidence of improvement in modulus, gas barrier property and in coefficient of thermal expansion (CTE) was reported in the literature.…”
Section: Introductionmentioning
confidence: 99%
“…However, their brittle nature due to its high cross-link density and poor resistance to crack propagation limits the applications in advanced aerospace structures. To overcome this problem various Engineering thermoplastics like polyether sulfone [2,3], polycarbonate [4,5], polyethylene tere phthalate [6,7], poly ether ether ketone/hydroxyl terminated poly (ether ether ketone) with pendant methyl groups (PEEKMOH) [8,9], Poly ether ether ketone/hydroxyl terminated poly ether ether ketone with pendant tertiary butyl groups [10][11][12][13] or poly (cyanoarylene ether)/hydroxyl terminated poly arylene ether nitrile with pendant tertiary butyl groups [14,15] have been used as a toughness modifiers for epoxy resin without sacrificing other thermomechanical properties. However no evidence of improvement in modulus, gas barrier property and in coefficient of thermal expansion (CTE) was reported in the literature.…”
Section: Introductionmentioning
confidence: 99%
“…It was reported that 4,4'-diamino diphenyl sulfone (DDS)-cured epoxy nanocomposites showed an exfoliated morphology with improved mechanical properties when dispersed through exerting shearing force on epoxy montmorillonite solution by ball milling. 19 The toughening effects of thermoplastic [21][22][23][24] and nanoclay 25 separately on the thermomechanical properties of epoxy systems have been studied enormously. However, no evidence of drastic increase in fracture toughness was reported in the open literature for epoxy clay nanocomposites.…”
Section: Introductionmentioning
confidence: 99%
“…The autocatalytic reaction mechanism of epoxy-amine systems has been extensively reported in the literature 38,[41][42][43] and is considered for modeling the curing reaction. [44][45][46][47] When curing a thermoset without a catalyst, the reaction of a primary amine with an epoxy results in a secondary amine. Subsequently, the reaction is autocatalyzed by the formed hydroxyl groups.…”
Section: Curing Behaviormentioning
confidence: 99%