Curing and thermal behavior of epoxy resin in the presence of silicon‐containing amide amines

Abstract

ABSTRACT:The article describes the synthesis and characterization of silicon-containing amide amines obtained by the reaction of bis(4-chlorobenzoyl)dimethylsilane with 4,4Ј-diaminodiphenyl ether, 4,4Ј-diaminodiphenyl methane, 4,4Ј-diaminodiphenyl sulfone/3,3Ј-diaminodiphenyl sulfone, bis(3-aminophenyl)methyl phosphine oxide, and tris(3-aminophenyl)phosphine oxide with dimethyl acetamide as a solvent. Structural characterization of amide amines was done with Fourier transform infrared and 1 H-NMR spectroscopy. We used these aromatic amide amines as curing agents to investigate the effect of structure and molecular size on the curing and thermal behavior of diglycidyl ether of bisphenol A (DGEBA). The curing behavior of DGEBA in the presence of stoichiometric amounts of silicon-containing aromatic amide amines was investigated by differential canning calorimetry. A broad exothermic transition in the temperature range of 200 -300°C was observed in all the samples. The peak exotherm temperature was lowest in the case of phosphorus-containing amides and was highest in the case of ether-containing amides. Thermal stability of the isothermally cured resins was evaluated with dynamic thermogravimetry in a nitrogen atmosphere. A significant improvement in the char yield was observed with silicon-containing amines, and it was highest in case of samples with both silicon and phosphorus as flame-retarding elements.

Facile synthesis of new thermally stable and organo-soluble polyamide-imides from phosphorus-containing aromatic amines and various dianhydrides

“…The structure of the PAIs was confirmed by FTIR, 1 H-NMR, 13 C-NMR, 31 Figure 4 shows the FTIR spectrum of PAIs PMDA/ BAP, BTDA/BAP, NTDA/BAP, and ODA/BAP. This spectrum showed -NH stretching frequency due to the amine group as a broad band in the range 3362-3403 cm -1 .…”

“…BAP (a) and TAP (b) were synthesized as per a reported procedure [31]. Pyridine (CDH, Delhi, India) was purified by distillation under reduced pressure over calcium hydride.…”

Synthesis and characterization of heat-resistant and soluble poly(amide-imide)s from unsymmetrical dicarboxylic acid containing 2-(triphenyl phosphoranylidene) moiety and various aromatic diamines

“…Bis (3-aminophenyl) isopropyl phosphine (BAP) and tris (3-aminophenyl) phosphine oxide (TAPO) were synthesized by nitration of diphenyl isopropyl phosphine and triphenyl phosphine oxide followed by reduction with Pd/C and hydrazine hydrate according to the procedure reported in literature. 33 Structures of all diamines are shown below:…”

Crosslinking of 1,9‐bis[glycidyloxypropyl]penta‐ (1′H,1′H,2′H,2′H‐perfluoroalkylmethylsiloxane)s with α,ω‐diaminoalkanes: The cure behavior and film properties

“…These include the incorporation of additive-type or chemically bonded flame retardants to the epoxy resin. In particular, curing agents containing organophosphorous groups, 19 -23 organosilicon groups, 24 or both 24,25 have received attention. Most epoxies absorb between 1 and 7 wt % water with a concomitant loss of physical properties.…”