1998
DOI: 10.1007/s001070050339
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Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints

Abstract: Thermomechanical analysis (TMA) results indicate that simple post-treatment (such as some postcuring) conditions capable of improving the mechanical performance of aminoplastic resins-bonded particleboard without any degradation do indeed exist. A model to describe the decrease in temperature under different conditions of a particleboard after hot pressing has been developed and shown to correlate well with experimental results of board temperature variation after pressing, both on cooling and during postcurin… Show more

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Cited by 15 publications
(5 citation statements)
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“…The hardening of the resin can be evaluated using DLTMA (Lu and Pizzi 1998;Garcia and Pizzi 1998;Onic et al 1998). Wood beech plies of 0.6-mm thickness were cut into 14 × 5 mm samples.…”
Section: Dynamic Load Thermo-mechanical Analysis (Dltma)mentioning
confidence: 99%
“…The hardening of the resin can be evaluated using DLTMA (Lu and Pizzi 1998;Garcia and Pizzi 1998;Onic et al 1998). Wood beech plies of 0.6-mm thickness were cut into 14 × 5 mm samples.…”
Section: Dynamic Load Thermo-mechanical Analysis (Dltma)mentioning
confidence: 99%
“…As expected, the maximum value of the MOE decreases with increase in the heating rate. The slower the heating rate applied, the later the MOE maximum presents itself 10–12. The curves describing the MOE increase and the maximum MOE values are always lower for the ammonium sulfate hardener than for the hexamine sulfate hardener.…”
Section: Discussionmentioning
confidence: 58%
“…The maximum value of mechanical resistance of a bonded wood joint is higher when the heating rate to cure is slower 10–12. This is the case both for aminoplastic and phenolic polycondensation resins.…”
Section: Discussionmentioning
confidence: 99%
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“…1) shows a large curing exotherm in the DSC curve, which means that its curing reaction is sufficient, thus ensuring its good bonding strength and water resistance. In addition, the peak curing temperature of HUG2 is 105°C, which is similar to that of UF resins in industrial production [28,29]. Therefore, the HUG2 resin has real potential as a substitute for UF resin.…”
Section: Thermal Characteristics Analysismentioning
confidence: 83%