Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents

Li, Xiayu; Guo, Pengxiang; Kong, Xiaoxiao; Wang, Yifang; Yang, Yong; Liu, Fang; Du, B. X.

doi:10.1109/tdei.2022.3224894

Cited by 17 publications

(4 citation statements)

References 35 publications

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“…In this study we followed a curing protocol for the four analyzed resins that is successfully established in our laboratory, i.e., using a curing temperature of 80 °C for 1 h. We did not investigate the effect of curing at various other higher temperatures and for various amount of times as reported elsewhere. [ 122 , 123 ] Whether the resins films crosslink at higher temperature and if they change the surface morphology during crosslinking, will be determined in a future, more focused study that will be meant to reveal also the compositional changes in the films that occur during the drying process. Our immediate interest was to provide a robust dielectric layer for further exploitation in OFET devices, and the curing process selected clearly proved its value.…”

Section: Discussionmentioning

confidence: 99%

Pinaceae Pine Resins (Black Pine, Shore Pine, Rosin, and Baltic Amber) as Natural Dielectrics for Low Operating Voltage, Hysteresis‐Free, Organic Field Effect Transistors

Coppola,

Petritz,

Irimia

et al. 2023

Global Challenges

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Four pinaceae pine resins analyzed in this study: black pine, shore pine, Baltic amber, and rosin demonstrate excellent dielectric properties, outstanding film forming, and ease of processability from ethyl alcohol solutions. Their trap‐free nature allows fabrication of virtually hysteresis‐free organic field effect transistors operating in a low voltage window with excellent stability under bias stress. Such green constituents represent an excellent choice of materials for applications targeting biocompatibility and biodegradability of electronics and sensors, within the overall effort of sustainable electronics development and environmental friendliness.

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Section: Discussionmentioning

confidence: 99%

Pinaceae Pine Resins (Black Pine, Shore Pine, Rosin, and Baltic Amber) as Natural Dielectrics for Low Operating Voltage, Hysteresis‐Free, Organic Field Effect Transistors

Coppola,

Petritz,

Irimia

et al. 2023

Global Challenges

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show abstract

“…The carboxyl anion is very easy to combine with the epoxy group to open the ring, causing further reaction, and finally forming a polyester cross-linking network; at the same time, the anion can also react with the anhydride group, and the ring-opening anhydride group continues to combine with the epoxy resin to continue to promote the construction of the cross-linking network. These two reactions will generate new anions, making the reaction continue [ 40 , 41 ]. The hydroxyl group can open the ring of anhydride or etherify the hydroxyl group directly with the epoxy group.…”

Section: Reaction Mechanism Of Anhydride-cured Epoxy Resinmentioning

confidence: 99%

“…Therefore, the characteristic temperature of reaction at different heating rates can be obtained by linear fitting, which is the temperature extrapolation method. Results in Table 1 show that the characteristic temperature of the epoxy resin system showed a downward trend with the increase of accelerator content, which corresponded to the catalytic characteristics of the accelerator [ 41 ]. It is generally believed that the peak initial temperature corresponds to the temperature at which the system starts to react, and the peak temperature corresponds to the temperature at which the reaction is most intense.…”

Section: Curing Kineticsmentioning

confidence: 99%

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Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review

Aung

2023

Molecules

Self Cite

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Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying and multiple voltage waveforms, which seriously threaten the safe and stable operation of the system. The curing regime, including mixture ratio and combination of curing time and temperature, is an important factor to determine the microstructure of epoxy resin, and also directly affects its macro performances. In this paper, the evolution of curing kinetic models of anhydride-cured epoxy resin was introduced to determine the primary curing regime. The influences of curing regime on the insulation performance were reviewed considering various mixture ratios and combinations of curing time and temperature. The curing regime-dependent microstructure was discussed and attributed to the mechanisms of insulation performance.

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Thermal and self‐curing kinetics of single pack epoxy adhesive with zeolitic imidazolate framework‐8

Shi,

Zhang,

Zheng

et al. 2024

J of Applied Polymer Sci

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Single pack epoxy adhesives, known for their simple operation process, combined with good reactivity at moderate temperatures and excellent storage stability, have gained extensive attention. An appropriate accelerator is crucial for enhancing their performance. This study demonstrates that the zinc zeolitic imidazolate framework ZIF‐8 (Zn(2‐methylimidazole)2) can effectively serve as an effective accelerator for the epoxy‐anhydride system, as evidenced by the complete exothermic curing curve obtained via differential scanning calorimetry (DSC) tests of the epoxy (A‐128) and anhydride (THPA) adhesive sample with ZIF‐8. The optimal addition amount of ZIF‐8 (0.9%) was determined by assessing the glass transition temperature (Tg) of the cured resin with varying ZIF‐8 weight fractions. Furthermore, the ideal curing conditions—gel temperature of 388.4 K, curing temperature of 416.7 K, and post‐treatment temperature of 441.9 K—were established by analyzing heating curves at different circumstances. The epoxy (A‐128) and anhydride (THPA) system with accelerator ZIF‐8 exhibited superior stability compared to the commercial accelerators like PN‐23 or DMP‐30. This is attributed to the steric hindrance and coordination bonds of ZIF‐8, indicated by a large pre‐exponential factor (A1 = 5.58 × 108) and low‐value reaction rate constant (k1 = 0.3461 × 10−3 s−1). In addition, the kinetic parameters, and an autocatalytic equation model for the epoxy (A‐128) and anhydride (THPA) system with accelerator ZIF‐8 have been derived through isothermal curing kinetics analysis.

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Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents

Cited by 17 publications

References 35 publications

Pinaceae Pine Resins (Black Pine, Shore Pine, Rosin, and Baltic Amber) as Natural Dielectrics for Low Operating Voltage, Hysteresis‐Free, Organic Field Effect Transistors

Pinaceae Pine Resins (Black Pine, Shore Pine, Rosin, and Baltic Amber) as Natural Dielectrics for Low Operating Voltage, Hysteresis‐Free, Organic Field Effect Transistors

Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review

Thermal and self‐curing kinetics of single pack epoxy adhesive with zeolitic imidazolate framework‐8

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