Curing kinetics study of an epoxy resin system for T800 carbon fiber filament wound composites by dynamic and isothermal DSC

Chen, Wei-Ming; Li, Peng; Yu, Yunhua; Yang, Xiaoping

doi:10.1002/app.26861

Cited by 36 publications

(24 citation statements)

References 34 publications

(38 reference statements)

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“…The constant k 1 in this equation can be calculated from the initial reaction rate at α = 0 [23]. The kinetic constants are assumed to be of the Arrhenius form, k 1 = A 1 exp(-E 1 /RT) and k 2 = A 2 exp(-E 2 /RT), where A 1 , A 2 are the pre-exponential constants, E 1 and E 2 are the activation energies, R is the gas constant, and T is absolute temperature.…”

Section: Isothermal Curing Analysis By Kamal Modelmentioning

confidence: 99%

Curing kinetics study of epoxy resin/hyperbranched poly(amideamine)s system by non-isothermal and isothermal DSC

2010

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Curing kinetics of epoxy resin/hyperbranched poly(amide amine)s (H-PAMAM) system was studied by non-isothermal and isothermal differential scanning calorimetry (DSC). Non-isothermal DSC scans indicated that H-PAMAM was an effective curing agent of epoxy resin. The apparent activation energy (E) was 54.3 kJ/mol calculated through Kissinger method, and the kinetic parameters were determined by Málek method for the kinetic analysis of the thermal treatment obtained by DSC measurement. A two-parameter (m, n) autocatalytic model (Sěsták-Berggren equation) was found to be the most adequate selected kinetic model. In addition, the predicted curves from the kinetic model fit well with the nonisothermal DSC thermogram. The isothermal DSC method was used to investigate the curing process for resin at 60, 65, 70, 75 and 80 °С, respectively. Isothermal kinetic parameters, including k 1 , k 2 , m and n, were determined based on an autocatalytic mechanism proposed by Kamal. Both models were validated for a fitting to the experimental data by the Levenberg-Marquardt method. A process to determine the initial values for the fitting procedure was also proposed. The predictions of the validated models were in good agreement with the measured data, and were therefore applicable for numerical process optimization.

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Section: Isothermal Curing Analysis By Kamal Modelmentioning

confidence: 99%

Curing kinetics study of epoxy resin/hyperbranched poly(amideamine)s system by non-isothermal and isothermal DSC

2010

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“…DAP may be regarded as mixed diamines when it cured with epoxy resin. 47 Herein, isoconversional method, which is a phenomenological method (no need of hypothesis for cure mechanism), was used to evaluate cure kinetics of TMBP/DAP system in the presence and absence of HPCTP.…”

Section: Structure Of Diamine Dapmentioning

confidence: 99%

Cure kinetics and thermal properties of tetramethylbiphenyl epoxy resin/phthalazinone‐containing diamine/hexa(phenoxy)cyclotriphophazene system

Zhang

Zhou

Sun

et al. 2009

J of Applied Polymer Sci

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Inherently flame retardant epoxy resin is a kind of halogen-free material for making high-performance electronic materials. This work describes an inherently flame retardant epoxy system composed of 4,4 0 -diglycidyl (3,3 0 ,5,5 0 -tetramethylbiphenyl) epoxy resin (TMBP), 1,2-dihydro-2-(4-aminophenyl)-4-(4-(4-aminophenoxy) phenyl) (2H) phthalazin-1-one (DAP), and hexa(phenoxy) cyclotriphophazene (HPCTP). The cure kinetics of TMBP/DAP in the presence or absence of HPCTP were investigated using isoconversional method by means of nonisothermal differential scanning calorimeter (DSC). Kinetic analysis results indicated that the effective activation energy (E a ) decreased with increasing the extent of conversion (a) for TMBP/DAP system because diffusion-controlled reaction dominated the curing reaction gradually in the later cure stage. TMBP/DAP/HPCTP(10 wt %) system had higher E a values than those of TMBP/DAP system in the early cure stage (a < 0.35), and an increase phenomenon of E a $ a dependence in the later cure stage (a ! 0.60) due to kinetic-controlled reaction in the later cure stage. Such complex E a $ a dependence of TMBP/DAP/ HPCTP(10 wt %) system might be associated with the change of the physical state (mainly viscosity) of the curing system due to the introduction of HPCTP. These cured epoxy resins had very high glass transition temperatures (202-235 C), excellent thermal stability with high 5 wt % decomposition temperatures (>340 C) and high char yields (>25.6 wt %).

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“…On the other hand, aliphatic-aminebased curing agents can be used to solidify epoxy resins at room temperature, and their applications in protective, industrial coatings, high-performance adhesives appears promising. It is known that the curing behavior of epoxy resins plays an extremely important role in determining their curing and processing condition as well as affecting the end-use properties [8][9][10] . However, to our best knowledge, the cure kinetic analysis of epoxy-new aliphatic amine reaction system is rarely reported in literature [11][12][13][14][15][16][17] .…”

Section: Introductionmentioning

confidence: 99%

Isothermal Cure of Bisphenol Epoxy Resin with a Nonlinear Aliphatic Polyamine Hardener

Zhou

Wang

Liú

et al. 2012

Polymer-Plastics Technology and Engineering

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An amine terminated polypropylenimine dendrimer (DABdendri-(NH 2 ) 4 ), was employed as a new nonlinear aliphatic curing agent for diglycidyl ether of bisphenol A (DGEBA). Isothermal curing reaction kinetics of DGEBA/DAB was investigated with a differential scanning calorimeter (DSC). The autocatalytic model proposed by Kamal was demonstrated for simulating the reaction kinetic in the initial stage of the cure. It was found that the overall reaction order, m þ n, was in the range 2.3688-2.5980. The rate constants of k l and k 2 , showed a good Arrhenius fit to temperature and the associated activation energies was estimated to be 60.41 kJ/mol and 55.66 kJ/mol, which showed in agreement with values reported for common epoxy-amine systems. In the latter stage of curing, diffusion control was considered and a diffusion factor was incorporated into the autocatalytic model; therefore, it was possible to accurately predict the cure kinetics over the whole range of conversion.

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Curing kinetics study of an epoxy resin system for T800 carbon fiber filament wound composites by dynamic and isothermal DSC

Cited by 36 publications

References 34 publications

Curing kinetics study of epoxy resin/hyperbranched poly(amideamine)s system by non-isothermal and isothermal DSC

Curing kinetics study of epoxy resin/hyperbranched poly(amideamine)s system by non-isothermal and isothermal DSC

Cure kinetics and thermal properties of tetramethylbiphenyl epoxy resin/phthalazinone‐containing diamine/hexa(phenoxy)cyclotriphophazene system

Isothermal Cure of Bisphenol Epoxy Resin with a Nonlinear Aliphatic Polyamine Hardener

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