2012
DOI: 10.1007/s00226-012-0503-x
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Curing kinetics study of melamine–urea–formaldehyde resin/liquefied wood

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Cited by 11 publications
(9 citation statements)
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“…20 The liquefied wood was added to the MUF resin precursor to reduce the extent of formaldehyde emission and cost. The MUF/liquefied wood resin exhibited a very complicated curing mechanism.…”
Section: Introductionmentioning
confidence: 99%
“…20 The liquefied wood was added to the MUF resin precursor to reduce the extent of formaldehyde emission and cost. The MUF/liquefied wood resin exhibited a very complicated curing mechanism.…”
Section: Introductionmentioning
confidence: 99%
“…. Recently, melamine‐modified UF resin draws more attention to the preparation of novel resin with liquefied wood with MUF and self‐healing MUF microcapsules, and performance improvement by modifying resin with poly(amidoamine)s dendrimers, PolyFox PF‐151N polymer, mimosa tannin resin, and nanoclay …”
Section: Introductionmentioning
confidence: 99%
“…The reason for reduced reaction enthalpy and therefore lower degree of cross-linking might be the fact that with increasing LW content in an adhesive mixture MF content and consequently the extent of MF cross-linking reactions per overall mixture is lowered. [35] Furthermore, LW is less reactive than MF resin adhesive and when introduced into the adhesive mixture it might act as filler which represents a barrier for MF functional groups to react and form crosslinked structure. We also observed that at lower additions of LW peaks were taller and narrower, which could imply that the adhesive cured more completely on smaller temperature range.…”
Section: Particleboard Production and Testingmentioning
confidence: 99%