2016
DOI: 10.2355/isijinternational.isijint-2015-260
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Curing Mechanism of Phenolic Resin Binder for Oxide-Carbon Refractories

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Cited by 11 publications
(6 citation statements)
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“…From the DTG plots, there are two prominent peaks for both resins; the first peak lies in the temperature range of 100-130 C while the second lies in the range 460-550 C. The first peak is due to the curing reaction, while the second peak is due to the decomposition of the phenolic resin leaving behind a carbonaceous residue. [36][37][38] According to De Souza et al, 37 there are no significant molecular size changes up to 350 C; only small molecular bridge transformations occur because of the release of volatile free molecules, notably water and phenol. As the curing reaction started, the increase in these activated volatile free molecules gave rise to the monotonic increase in the DTG curve until it got to the maximum temperature of 100-130 C for both phenolic resoles.…”
Section: Thermal Analysismentioning
confidence: 99%
See 1 more Smart Citation
“…From the DTG plots, there are two prominent peaks for both resins; the first peak lies in the temperature range of 100-130 C while the second lies in the range 460-550 C. The first peak is due to the curing reaction, while the second peak is due to the decomposition of the phenolic resin leaving behind a carbonaceous residue. [36][37][38] According to De Souza et al, 37 there are no significant molecular size changes up to 350 C; only small molecular bridge transformations occur because of the release of volatile free molecules, notably water and phenol. As the curing reaction started, the increase in these activated volatile free molecules gave rise to the monotonic increase in the DTG curve until it got to the maximum temperature of 100-130 C for both phenolic resoles.…”
Section: Thermal Analysismentioning
confidence: 99%
“…This difference would have been eliminated with the evaporation of the solvents in the resins during the prior curing process of the as-received phenolic resin. Above roughly 350 C, new volatile substances are released, indicating the beginning of a dehydrationcondensation reaction 38 during which molecular degradation starts, giving rise to a reduced molecular mass of the phenolic resin. Volatiles such as H 2 O, CO, CO 2 , H 2 , CH 4 , C 2 H 2 , C 2 H 6 , phenol, and its methyl derivatives are released, which takes place in the temperature range of 350-800 C during pyrolysis of the phenolic resin.…”
Section: Thermal Analysismentioning
confidence: 99%
“…Figure 1b shows the TGA results from tests with a temperature increase of 10 K/min up to 1000°C. The mass loss of FRP 1 shows an expected behaviour, with a high mass loss rate from degradation of the phenolic resin between 400 and 600°C [37]. At higher temperatures the mass loss has ceased, and the results are revealing a residue content of about 40 weight-% including the basalt fibres [39,40].…”
Section: Tga-thermal Gravimetric Analysismentioning
confidence: 84%
“…When conducting TGA analysis of phenol resins in an oxygen atmosphere, an oxidation might occur and result in the small mass loss observed already at lower temperatures, as described in [36]. Another possible explanation could be release of uncured resin and water [37].The limited mass loss seen for FRP 3 would be a result of the high thermal stability of the PFA resin [38]. To conduct thermal ageing at 90°C with these composites seems acceptable due to the slow and steady degradation rate in this temperature range, and especially for FRP 3, which showed to be very thermally stable.…”
Section: Tga-thermal Gravimetric Analysismentioning
confidence: 99%
“…Among the polymers used in carbon nanocomposites, the phenolic resin has stood out for presenting dimensional and thermal stability, chemical resistance at high temperatures, and low cost compared to other thermoset polymers found on the market [12,14]. Phenolic resins (PR) have a wide range of applications, such as in heat-shields for the aerospace industry [4], automotive parts [15], refractory binders [16], wood adhesives [17], and others due to their fire retardant and electromagnetic interference shielding [18], low flammability, low smoke emission levels under fire conditions, and good chemical resistance [19,20]. The use of pure PR as an integral part of composites/nanocomposites depends on its type of preparation [21][22][23].…”
Section: Introductionmentioning
confidence: 99%