Curing performance of visible-light-cured dental resins due to a selectively-filtered visible-light unit

Hirose, Takaaki; Wakasa, K.; Yamaki, M.

doi:10.1007/bf00585427

Cited by 5 publications

(2 citation statements)

References 23 publications

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“…Transmission Fourier transform-infrared analysis (FT-IR) [4] and thermoanalytical methods [5][6][7][8][9][10] have shown that resin polymerization appears to be due to the monomer composition of dental resin and the concentration of camphorquinone (CQ) and reducing agents as the photo-initiator in relation to base monomers. Photopolymerization of dental composite resins was initiated by visible light in a spectrum range of 400 to 650 nm [11 13].…”

Section: Introductionmentioning

confidence: 99%

“…They were heated to 800°C with a heating rate of 10 °C min-1 during the DTA measurement and also cured with radiation from a visible light source (Quick Light, J. Morita Co, Kyoto) for 120 s at 37 °C during the DSC measurement (ambient temperature, N2 gas flow). The same conditions as previously reported were used for DTA and DSC analyses [8,9,13]. …”

Section: Introductionmentioning

confidence: 99%

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Dental application of crystalline monomer with urethane linkages: a thermoanalytical study on bis-GMA-based resins

Tsuji¹,

Wakasa²,

Yamaki³

1995

J Mater Sci: Mater Med

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The thermal properties of bis-GMA-based resins containing a synthesized crystalline DME-TDC which was dissolved to bis-GMA/'FEGDMA base resin by 10 or 20wt% were examined. Camphorquinone (0.5%) and a reducing agent (0.5%) were added to the base resin before the addition of DME-TDC. A thermoanalytical study using differential thermal analysis (DTA) and differential scanning calorimetry (DSC) showed that thermal change in the DTA and DSC curves depended on the composition of the bis-GMA-based resins. Heat for curing was lowest in 50/50 base resin of 40wt% bis-GMA/60wt% TEGDMA, 50/50 and 60/40 base resins in DTA analysis during heating. The addition of DME-TDC to each resin increased heat requirements in 50/50 resin and decreased heat requirements in 40/60 and 60/40 resins. The thermal decomposition of 50/50 bis-GMA-based resin including DME-TDC occurred at a higher temperature than that in 40/60 and 60/40 based resin. The value of activation energy for curing performance was lowest for a DME-TDC including bis-GMAbased resin.

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