Curing processes of binary epoxy-amine systems for manufacturing epoxy-silica films

Naeemikhah, Elham; Khaneghah, Aziz Ahmadi; Shamsi-Jamkhaneh, Zeinab; Behniafar, Hossein

doi:10.1080/10426914.2020.1750632

Cited by 7 publications

(1 citation statement)

References 45 publications

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“…The thermomechanical properties of an epoxy material may also be improved by incorporating silica (SiO 2 ) 27,28 or its precursors 14,29 at the curing stage, which results in a nanocomposite material. However, in this case, the curing rate decreases, and problems of compatibility of the precursor with the epoxy matrix 29 and uniform distribution of the nanofiller in the material bulk often appear 30 .…”

Section: Introductionmentioning

confidence: 99%

Monitoring the curing processes of epoxy oligomers with partially substituted polyethoxymetallosiloxanes by IR spectroscopy and thermomechanical analysis

Parshina

Tarasenkov

Aysin

et al. 2021

J of Applied Polymer Sci

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In this work, the curing of «ED‐20» epoxy resin with partially siloxy‐substituted aluminum, iron, and zirconium siloxanes that we obtained previously was studied. The initial content of a metallosiloxane in the compositions was 5–50 wt% with respect to the resin. In all the cases, thermal curing was used to obtain a series of samples in the form of solid homogeneous materials. The fact of the epoxy ring opening in the resin was confirmed by IR spectroscopy. The catalytic properties of the metal atom in a metallosiloxane were found to affect the curing process. The samples demonstrate rather a high resistance to thermooxidative destruction, and in most cases, their glass transition temperatures are lower than those obtained upon standard curing of «ED‐20» resin with triethylenetetramine. Partially siloxy‐substituted metalloalkoxysiloxanes can be efficient agents for curing and formation of a hybrid material based on epoxy resins.

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Section: Introductionmentioning

confidence: 99%

Monitoring the curing processes of epoxy oligomers with partially substituted polyethoxymetallosiloxanes by IR spectroscopy and thermomechanical analysis

Parshina

Tarasenkov

Aysin

et al. 2021

J of Applied Polymer Sci

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Enhancement of Moisture‐Resistant Performance of Epoxy Resins via Introduction of Hydrophobic and Flexible Chains

Zhu,

Yang,

et al. 2024

Macro Chemistry & Physics

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The introduction of long and flexible polyether chains in epoxy resins is an effective method to improve their toughness. However, using the hydrophilicity/hydrophobicity of polyether chains to tune their moisture resistance has been overlooked currently. In this work, two types of polyether‐based diglycidyl ethers with hydrophilic poly(oxyethylene) (DGEPOE) and relatively hydrophobic poly(oxybutylene) segments (DGEPOB) are synthesized and then binary‐cured with commercial diglycidyl ether of bisphenol A (DGEBA), respectively, yielding the corresponding DGEPOE:DGEBA‐m:ns and DGEPOB:DGEBA‐m:ns based on various ratios. For comparison, pure DGEPOEr, DGEPOBr, and DGEBAr resins are also prepared. Results show that the equilibrium water uptake of DGEPOB:DGEBA‐m:ns is at least less than one‐fifth of that of DGEPOE:DGEBA‐m:ns; meanwhile, the diffusion coefficients of water molecules in DGEPOB:DGEBA‐m:ns are also 1–2 orders of magnitude lower than those in DGEPOE:DGEBA‐m:ns, demonstrating that the incorporation of hydrophobic POB chains can significantly reduce the hygroscopicity of resins. Moreover, DGEPOB:DGEBA‐m:ns not only exhibit superior flexibility and ductility relative to pure DGEBAr, but display exceptional strength and toughness in comparison with pure DGEPOBr. These findings suggest that tuning the hydrophilicity/hydrophobicity of building units of epoxy monomers offers a promising strategy for developing high‐performance epoxy materials, especially suitable for humid environments.

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Thermal stability and dynamic mechanical thermal analysis of epoxy thermosets possessing N,N′-disubstituted pyromellitimide units

Ahmadi-khaneghah

Behniafar

Pourali

2020

International Journal of Polymer Analysis and Characterization

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Curing processes of binary epoxy-amine systems for manufacturing epoxy-silica films

Cited by 7 publications

References 45 publications

Monitoring the curing processes of epoxy oligomers with partially substituted polyethoxymetallosiloxanes by IR spectroscopy and thermomechanical analysis

Monitoring the curing processes of epoxy oligomers with partially substituted polyethoxymetallosiloxanes by IR spectroscopy and thermomechanical analysis

Enhancement of Moisture‐Resistant Performance of Epoxy Resins via Introduction of Hydrophobic and Flexible Chains

Thermal stability and dynamic mechanical thermal analysis of epoxy thermosets possessing N,N′-disubstituted pyromellitimide units

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