1996
DOI: 10.1049/ip-cds:19960567
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Current analysis of polyimide passivated InGaP/GaAs HBT

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Cited by 10 publications
(9 citation statements)
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“…The devices are transfer printed in deterministic assembly onto a temporary Si substrate using ultrathin polyimide (PI, ∼1 μm) as an adhesive, followed by ground–signal–ground (G–S–G) RF interconnect metallization. PI is an excellent material for GaAs-based devices not only as an adhesive, but also as a passivating material that can suppress the high surface states of GaAs and prevent leakage current 37 . Devices are then released from the temporary substrate and printed onto a CNF substrate using a PDMS stamp ( Supplementary Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The devices are transfer printed in deterministic assembly onto a temporary Si substrate using ultrathin polyimide (PI, ∼1 μm) as an adhesive, followed by ground–signal–ground (G–S–G) RF interconnect metallization. PI is an excellent material for GaAs-based devices not only as an adhesive, but also as a passivating material that can suppress the high surface states of GaAs and prevent leakage current 37 . Devices are then released from the temporary substrate and printed onto a CNF substrate using a PDMS stamp ( Supplementary Fig.…”
Section: Resultsmentioning
confidence: 99%
“…A further effect of current stressing is an observed positive shift in the emitter/base voltage, which was attributed to Be diffusion [5] from the base. However, the devices in this study are C-doped and still this positive shift occurred; interface effects are responsible for this effect [6].…”
Section: Introductionmentioning
confidence: 68%
“…Similarly the collector current I c comprises: (i) the electron current injected across the heterointerface (I n ), which in abrupt heterojunctions is governed by the thermionic tunnelling (I Tun ); (ii) drift-diffusion current (I diff ) for the remainder of the device; (iii) the leakage current, I cleak , originating from the emitter/base and the base/collector peripheries. The total base and collector currents are given by [7]…”
Section: Theorymentioning
confidence: 99%
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