Current capacity and thermal transport in carbon nanofiber interconnects

Fabris, Drazen; Saito, Tsutomu; Yamada, Toshio; Sun, Xuhui; Wilhite, Patrick; Yang, Cary Y.

doi:10.1109/nems.2009.5068708

Cited by 2 publications

(2 citation statements)

References 22 publications

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“…The 2D model solutions are compared with a simplified model developed for similar 1D systems [32][33][34]. The model previously presented is the 1D simplification of the model proposed in this work which is applicable when temperature dependence in y can be neglected, i.e., @ 2 DT @y 2 ¼ 0.…”

Section: Resultsmentioning

confidence: 99%

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Cardenas¹,

Fabris²,

Tokairin

et al. 2012

Journal of Heat Transfer

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To improve performance and reliability of integrated circuits, accurate knowledge of thermal transport properties must be possessed. In particular, reduced dimensions increase boundary scattering and the significance of thermal contact resistance. A thermoreflectance measurement can be used with a valid heat transport model to experimentally quantify the contact thermal resistance of thin film interconnects. In the current work, a quasi-steady state thermoreflectance measurement is used to determine the temperature distribution of a thin film gold interconnect (100 nm) undergoing Joule heating. By comparing the data to a heat transport model accounting for thermal diffusion, dissipation, and Joule heating, a measure of the thermal dissipation or overall thermal resistance of unit area is obtained. The gold film to substrate overall thermal resistance of unit area beneath the wide lead (10 μm) and narrow line (1 μm) of the interconnect are 1.64 × 10−6 m2 K/W and 5.94 × 10−6 m2 K/W, respectively. The thermal resistance of unit area measurements is comparable with published results based on a pump-probe thermoreflectance measurement.

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Section: Resultsmentioning

confidence: 99%

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Cardenas¹,

Fabris²,

Tokairin

et al. 2012

Journal of Heat Transfer

Self Cite

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“…When one creates micro and nanoelectronical devices based on flexible substrates (flexible electronics) the most important are acceptable mechanical and conducting properties of the film materials based on CNT than based on well-known semiconductor and metal materials. It should be noted that for CNT the ratios of the breaking strength derivative (~10 GPa [1]) and specific conductivity (   [2]) to the material density is several orders of magnitude greater than ones for Cu or Al films and wires that are commonly used in microelectronics [3,4]. For example in Cu nanowires the value of the current density was achieved several orders of magnitude smaller than in CNT wires  at which the material starts to fail.…”

Section: Introductionmentioning

confidence: 98%

Electrically-Conductive Composite Nanomaterial with Multi-Walled Carbon Nanotubes

Ичкитидзе¹,

Podgaetsky²,

Селищев³

et al. 2013

MSA

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Specific conductivity $\sigma$ of the composite nanomaterial layers with micron and submicron dimensions, consisting of carboxymethyl cellulose (CMC) and multiwalled carbon nanotubes (MWCNT) was investigated. Ultradispersed aqueous suspension was deposited on soft (aluminum foil, plates made from polyester and polyimide, cotton fabric, office paper) and solid (coverslip, silicon wafers with silicon oxide layer) substrates by silk-screen printing. Electrical resistance was measured by four-probe method and by the method of square on surface from which the conductivity and conductivity per square of surface were calculated taking into account layer’s geometric dimensions. Specific conductivity of the layers with thickness range 0.5 - 5 μm was $\sigma$ ~1.2×10⁴÷4×10⁴ S/m, and max conductivity per square was ~ 0.2 S. Investigated nanomaterial is attractive to electronic and biomedical applications.

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Current capacity and thermal transport in carbon nanofiber interconnects

Cited by 2 publications

References 22 publications

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Electrically-Conductive Composite Nanomaterial with Multi-Walled Carbon Nanotubes

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