Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996 1996
DOI: 10.1109/pvsc.1996.563966
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Current status of low-temperature radiator thermophotovoltaic devices

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Cited by 11 publications
(2 citation statements)
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“…When these compounds are incorporated as the 'active' radiation absorbing layer and host the p-n junction of the TPV cell, the bandgap of the alloy determines the spectral response and photovoltage of the cell, and is thus the most important cell parameter from the point of view of system design. Currently, low-bandgap (∼0.5 eV) GaSb-based alloy TPV cells represent the most developed technology for applications requiring a spectral response out to 2.5 µm wavelength, and based solely on this, are the best candidate for the various low-temperature (∼1000 • C) thermal emitter applications that arose in the mid-1990s [1][2][3][4][5][6][7]. These alloys are almost always used as epitaxial thin film structures grown on GaSb substrates, although epitaxy on other substrates (InAs, GaAs, silicon, etc) is at least feasible, as are wafer bonding techniques to transfer the epitaxial device structure to a surrogate substrate.…”
Section: Scope Of Reviewmentioning
confidence: 99%
“…When these compounds are incorporated as the 'active' radiation absorbing layer and host the p-n junction of the TPV cell, the bandgap of the alloy determines the spectral response and photovoltage of the cell, and is thus the most important cell parameter from the point of view of system design. Currently, low-bandgap (∼0.5 eV) GaSb-based alloy TPV cells represent the most developed technology for applications requiring a spectral response out to 2.5 µm wavelength, and based solely on this, are the best candidate for the various low-temperature (∼1000 • C) thermal emitter applications that arose in the mid-1990s [1][2][3][4][5][6][7]. These alloys are almost always used as epitaxial thin film structures grown on GaSb substrates, although epitaxy on other substrates (InAs, GaAs, silicon, etc) is at least feasible, as are wafer bonding techniques to transfer the epitaxial device structure to a surrogate substrate.…”
Section: Scope Of Reviewmentioning
confidence: 99%
“…The ideality factor at fow current levels is -2.4. There is a datively large leakage current at low bias, which may be related to tunnelling [13]. However, it will not affect the performance of TPV cells which operate at very high current densities.…”
Section: Resultsmentioning
confidence: 99%