Cutting strength — A new indicator for the mechanical strength of materials

Saito, Fuminori; Nishiyama, Itsuo; Hyodo, Toshio

doi:10.1016/j.matlet.2011.02.027

Cited by 5 publications

(5 citation statements)

References 13 publications

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“…where r is the density of the target material. 12 If z(E p ) is determined by an independent method, it is possible to estimate the target density as…”

Section: Discussionmentioning

confidence: 99%

Characterization of ion-irradiated poly-l-lactic acid using nano-cutting

Saito

Yotoriyama

Nishiyama³

et al. 2014

Phys. Chem. Chem. Phys.

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Effects on the mechanical strength of poly-L-lactic acid (PLLA) upon irradiation with 150 keV He(+) ion were studied. Changes in the irradiated surface were investigated using a surface texture and contour measuring instrument and an atomic force microscope. Observations made with the atomic force microscope revealed that the irradiated surface subsided significantly as the fluence increased. In order to investigate the dependence on fluence of the depth of the Bragg peak for the ion implantation, the cutting strength, Σ, was analysed [F. Saito, I. Nishiyama and T. Hyodo, Mater. Lett., 2012, 66, 144-146]; this value is an indicator of the strength of a material against cutting, and is obtained from the cutting resistance. The averaged ion projected range increased from about 1.1 μm for a fluence of 1 × 10(15) He(+)/cm(2) to about 4 μm for a fluence of 1 × 10(16) He(+)/cm(2). The density of the region following irradiation was estimated using a combination of cutting resistance measurements and positron annihilation γ ray Doppler broadening measurements made with an energy-variable positron beam. The density decreased from the value of 1.27 g cm(-3) to about 0.6 g cm(-3) after irradiation with a fluence of 3 × 10(15) He(+)/cm(2). By considering the decrease in the density and the subsidence of the surface, it is concluded that only 30% of the original weight remained in the irradiated region after exposure to the He(+) ions. Anisotropic change in the cutting resistance suggests that mechanical strength in the direction normal to the surface increased while that in the lateral direction decreased.

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“…where r is the density of the target material. 12 If z(E p ) is determined by an independent method, it is possible to estimate the target density as…”

Section: Discussionmentioning

confidence: 99%

Characterization of ion-irradiated poly-l-lactic acid using nano-cutting

Saito

Yotoriyama

Nishiyama³

et al. 2014

Phys. Chem. Chem. Phys.

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“…The peel testing on a small area was conducted using a SAICAS (Nagai et al, 2002;Oyane et al, 2009;Saito et al, 2009Saito et al, , 2012Iwamori et al, 2010). The blade was made of diamond and had a width of 0.1 mm.…”

Section: Measurement Of the Peel Strength Using Saicasmentioning

confidence: 99%

“…Peel strength is one of the most important mechanical properties used to evaluate interfacial fracture energy. The peel testing on a small area was conducted using a SAICAS (Nagai et al, 2002;Oyane et al, 2009;Saito et al, 2009Saito et al, , 2012Iwamori et al, 2010). The blade was made of diamond and had a width of 0.1 mm.…”

Section: Measurement Of the Peel Strength Using Saicasmentioning

confidence: 99%

“…A recently developed surface and interfacial cutting analysis system (SAICAS) has great potential for use in determining the surface mechanical properties from applied load -penetration depth curves. In previous studies regarding SAICAS, Nagai et al (2002) reported on chemical bonding changes as a function of depth using SAICAS, Oyane et al (2009) reported on the shear strength of a lamin-apatite composite layer formed on an ethylene-vinyl alcohol copolymer, Saito et al (2009Saito et al ( , 2012 reported on the mechanical characterization of materials near the surface using a nanocutting process, and Iwamori et al (2010) reported on the shear stress between polymer thin films and a SUS302 substrate using SAICAS.…”

Section: Introductionmentioning

confidence: 99%

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Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Huh

Kim²,

Kim³

2014

Circuit World

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Purpose -The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 908 peel test. Design/methodology/approach -In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system. Findings -The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm 2 1 ) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.Research limitations/implications -It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro-and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials. Originality/value -From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.

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“…Electroplated and sputtered Cu films are considered to be nano-crystalline structures, where surface cracks are typical fracture failures. To determine the shear strength as a fracture resistance of the Cu films, a precise chip-forming process was conducted based on the cutting test suggested by the Merchant’s cutting model [ 18 , 19 ]. According to the Merchant’s cutting model, chip formation is related to the strength of the material when it is subjected to plastic deformation.…”

Section: Introductionmentioning

confidence: 99%

Measurement of Shear Strengths of Cu Films Using Precise Chip Forming

Lee

Kwak

2022

Materials

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The mechanical properties of thin films are under-researched because of the challenges associated with conventional experimental methods. We demonstrate a technique for determining the intrinsic shear strength and strain of thin films using a nano-cutting technique based on an orthogonal cutting model with precise control of the cutting system. In this study, electroplated Cu films with thicknesses of 1.5 μm and 5 μm and a sputtered Cu film with a thickness of 130 nm were fabricated to evaluate the mechanical strength. Experiments revealed a shear strength of approximately 310 MPa with a shear strain of 1.57 for the electroplated Cu film and a shear strength of 389 MPa with a shear strain of 2.03 for the sputtered Cu film. In addition, X-ray diffraction analysis was performed to correlate the experimental results.

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Cutting strength — A new indicator for the mechanical strength of materials

Cited by 5 publications

References 13 publications

Characterization of ion-irradiated poly-l-lactic acid using nano-cutting

Characterization of ion-irradiated poly-l-lactic acid using nano-cutting

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Measurement of Shear Strengths of Cu Films Using Precise Chip Forming

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