“…[ 8 ] Compared with surface modification, electrolyte additive is a more economical and effective method to improve the interface stability of LiNi 0.5 Mn 1.5 O 4 cathode. [ 9 ] At present, different film‐forming additives including trifluoromethyl sulfide (PTS), [9d] 1,1‐sulfonyldiimidazole (SDM), [ 10 ] allyloxytrimethylsilsilane (AMSL), [ 11 ] tris(pentafluorophenyl)silane (TPFPS), [ 12 ] (pentafluorophenyl)diphenylphosphine (PFPDPP), [ 13 ] p‐toluenesulfonyl isocyanate (PTSI), [ 14 ] tris(pentafluorophenyl)borane (TPFPB), [ 15 ] 3‐(trimethylsilyl)‐2‐oxazolidinone (TMS‐ON), [ 16 ] and so on have been used to improve the interface stability of the LiNi 0.5 Mn 1.5 O 4 , but it finds that some film‐forming additives also increase the interface resistance, which is harmful to the rate performance of the cells. [ 10,17 ] To compare with aforementioned film‐forming additives, using a monomer of a conductive polymer as a film‐forming additive is a more effective method to improve the interface stability because it can not only effectively protect the surface of cathode, but also improve the rate performance of cells by its excellent conductivity.…”