Cyclic fatigue-crack propagation along ceramic/metal interfaces

Cannon, R. M.; Dalgleish, B.J.; Dauskardt, Reinhold H.; Oh, Tae-Sung; Ritchie, R.O.

doi:10.1016/0956-7151(91)90184-3

Cited by 86 publications

(34 citation statements)

References 17 publications

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“…Considering a metal-ceramic interface has several advantages over the homogeneous material case: (i) crack growth along interfaces occurs when the interfacial cohesive strength is lower than that of the surrounding homogeneous materials; with decreasing cohesive strength the plastic zone size decreases, which reduces the computational time and decreasing cohesive strength increases the effective cohesive length, which improves numerical accuracy for a given mesh resolution [25]; (ii) along a bimaterial interface, crack growth often occurs along the interface so that our assumption of straight-ahead crack growth is appropriate; and (iii) even though straight-ahead crack growth occurs, the mismatch in material properties allows mixed-mode loading effects to be explored. In addition, fatigue crack growth along metal-ceramic interfaces is of interest in its own right, see [20][21][22]26]. …”

Section: Introductionmentioning

confidence: 99%

Discrete dislocation modeling of fatigue crack propagation

Deshpande

Needleman

Giessen³

2002

Acta Materialia

128

100

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Discrete dislocation modeling of fatigue crack propagation Deshpande, V.S.; Needleman, A.; van der Giessen, E.Published in: Acta Materialia DOI: 10.1016/S1359-6454(01)00377-9IMPORTANT NOTE: You are advised to consult the publisher's version (publisher's PDF) if you wish to cite from it. Please check the document version below. Document VersionPublisher's PDF, also known as Version of record Publication date: 2002Link to publication in University of Groningen/UMCG research database Citation for published version (APA): Deshpande, V. S., Needleman, A., & van der Giessen, E. (2002). Discrete dislocation modeling of fatigue crack propagation. Acta Materialia, 50(4), 831-846. [PII S1359-6454(01)00377-9]. https://doi.org/10.1016/S1359-6454(01)00377-9 Copyright Other than for strictly personal use, it is not permitted to download or to forward/distribute the text or part of it without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license (like Creative Commons).Take-down policy If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim.Downloaded from the University of Groningen/UMCG research database (Pure): http://www.rug.nl/research/portal. For technical reasons the number of authors shown on this cover page is limited to 10 maximum. AbstractAnalyses of the growth of a plane strain crack subject to remote mode I cyclic loading under small-scale yielding are carried out using discrete dislocation dynamics. Cracks along a metal-rigid substrate interface and in a single crystal are studied. The formulation is the same as that used to analyze crack growth under monotonic loading conditions, differing only in the remote stress intensity factor being a cyclic function of time. Plastic deformation is modeled through the motion of edge dislocations in an elastic solid with the lattice resistance to dislocation motion, dislocation nucleation, dislocation interaction with obstacles and dislocation annihilation being incorporated through a set of constitutive rules. An irreversible relation is specified between the opening traction and the displacement jump across a cohesive surface ahead of the initial crack tip in order to simulate cyclic loading in an oxidizing environment. The cyclic crack growth rate log(da/dN) versus applied stress intensity factor range log(⌬K I ) curve that emerges naturally from the solution of the boundary value problem shows distinct threshold and Paris law regimes. Paris law exponents in the range 4 to 8 are obtained for the parameters employed here. Furthermore, rather uniformly spaced slip bands corresponding to surface striations develop in the wakes of the propagating cracks. 

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Section: Introductionmentioning

confidence: 99%

Discrete dislocation modeling of fatigue crack propagation

Deshpande

Needleman

Giessen³

2002

Acta Materialia

128

100

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“…Albeit a rare event, such findings are uncommon in regular 4-point bend delamination test (Ma, 1997 Reimanis et al, 1990Reimanis et al, , 1991Ritchie et al, 1993;Phillipps et al, 1993;Ma et al, 1995Ma et al, , 1997Klingbeil and Beuth, 1997;Dauskardt, et al, 1998;Lane, et al, 2000aLane, et al, , 2000bHasegawa, et al, 2003;Hughey, et al, 2004;Shaviv, et al, 2005), corresponding investigations and experimental results on subcritical crack growth properties are extremely limited (Oh et al, 1988;Cannon et al, 1991;Shaw et al, 1994;McNaney et al, 1996;Hasegawa and Kagawa, 2006;Hirakata, et al, 2006). In this chapter, the dependence of FCG on metal layer thickness in a multi-layer thin film stack is studied.…”

Section: Discussionmentioning

confidence: 99%

“…For example, Suresh (1983Suresh ( , 1985 indicated that methods by which the path of a crack can be periodically deflected from its nominal growth plane offered one possible way of enhancing the fatigue crack growth resistance. Cannon et al, (1991) Figure 10.1 shows SEM micrographs of a MEMS relevant sample with multilayer thin film structure. The multi-layer structure was manufactured by using the standard integrated circuit fabrication processes.…”

Section: Discussionmentioning

confidence: 99%

“…Besides constraint plasticity effects, other mechanisms such as crack deflection also affect fracture toughness. Actually, crack deflection from one interface to the other has often been observed for ceramic/metal sandwich geometries (Oh, et al, 1988;Cannon, et al, 1991;Reimanis, 1991;Howard and Clyne, 1993;McNaney, et al, 1996). By introducing crack bridging due to crack deflection at particles or interfaces, factors of 3 increases in toughness can be obtained (Ritchie, 1999).…”

Section: Czm -Under Fatigue Loadingmentioning

confidence: 99%

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Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and Numerical studies predict that increased constraint and smaller size will accelerate fatigue failure due to changes in plastic deformation. Strain gradients significantly affect the process. Measurements of toughness and fatigue crack growth resistance for the model material system are reported. New test protocols for the commonly used 4 point bend delamination test are developed such that both cracks can be propagated and the number of test data obtained is doubled. The novel approach is also essential for fatigue crack growth. While crack growth resistance was rather independent of the thickness of and fatigue crack growth rates were found to be dependent of film thickness. The dependence of the failure behavior on film thickness arises primarily due to enhanced crack path deflection for decreasing film thickness. Material separation in fracture and fatigue is characterized through a cohesive zone law. The model captures the Paris-law type response obtained in experiments, and also predicts that for thinner films the tendency to crack. Damage tolerant design requires accurate data on residual strength and fatigue crack growth resistance. Both quantities, however, depend on constraint and size of the structure considered. While this has been accounted for in residual strength analysis in the past, the present work provides enabling technologies to solve this problem for fatigue. With the conventional approach to fatigue crack growth, the transferability of data from lab to field, or between specimens and structures is not ensured. Thus, coefficients in the Paris law need to be determined experimentally for each level of constraint or each size of interest. It is, however, not ensured that even a large set of experiments will be able to capture all possible load scenarios. The cohesive zone model approach is provided here as alternative. Once cohesive zone parameters are determined, the dependence of fatigue crack growth on constraint and size emerges as the natural outcome of the analysis without the need to further model modifications. 3

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“…In order to design reliable engineering systems using such bimaterial interfaces, the structural integrity of the interface must be maintained over the lifetime of the component. While much research has been conducted on the strength and fast fracture behavior of oxide/metal interfaces [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15], previous work is limited to only a handful of studies that focused on time dependent crack growth at and near interfaces, specifically, fatigue crack growth under cyclic loading [16][17][18][19] and moisture-assisted crack growth under static loading [20][21][22][23]. Additionally, layered material systems are quite common, and in metal layers, plastic deformation is often constrained by the oxide when plasticity extends across the entire layer during failure.…”

Section: Introductionmentioning

confidence: 99%

Time Dependent Debonding of Aluminum/Alumina Interfaces under Cyclic and Static Loading

et al. 2000

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The structural integrity of oxide/metal interfaces is important in many applications. While most attention has focused on the debonding of oxide/metal interfaces by conducting strength and fracture toughness tests, very few investigations have looked at time dependant failure of interfaces under cyclic or static loading. Tests have been conducted on sandwich specimens consisting of 5 -100 micron thick aluminum layers bonded between either polycrystalline or single crystal Al 2 O 3 to determine cyclic fatigue-crack growth, as well as static loaded moistureassisted crack-growth, properties of Al/Al 2 O 3 interfaces. Under cyclic loading, crack growth was observed to occur predominantly by interfacial debonding, but was also observed to make excursions into the Al 2 O 3 . Static loading in a moist environment also caused interfacial cracks to deviate into the Al 2 O 3 or alternatively to arrest. Due to the poor crack growth resistance of the Al 2 O 3 , cracks leaving the interface grew at faster rates than those at the interface. Trends in crack trajectories and crack growth rates are explained in terms of the degree of plastic constraint in the aluminum layer, the modulus mismatch, and the effects of environmental mechanisms.

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Cyclic fatigue-crack propagation along ceramic/metal interfaces

Cited by 86 publications

References 17 publications

Discrete dislocation modeling of fatigue crack propagation

Discrete dislocation modeling of fatigue crack propagation

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Time Dependent Debonding of Aluminum/Alumina Interfaces under Cyclic and Static Loading

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