Cyclic olefin copolymer‐based copper clad laminate and the application for low loss broadband baluns

Zheng, Shimin; Chen, Haidong; Chen, Huibing; Zhang, Wenhai; Xue, Quan; Che, Wenquan

doi:10.1002/mmce.22956

Cited by 6 publications

(3 citation statements)

References 33 publications

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“…Finally, plasma‐treated LCP and oxidized copper coated with functionalized agent were laminated at 180°C to obtain the final sample. The peel test results showed that the peeling strength of the sample reached 8.92 N cm −1 , which met the standard for industrial application 28,29 …”

Section: Introductionmentioning

confidence: 65%

Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating

Chen

Feng

et al. 2022

J of Applied Polymer Sci

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Liquid crystal polymer (LCP) has been employed as a major type of substrate in flexible printed circuit manufacturing due to its excellent electrical and mechanical properties. In order to improve the peel strength of LCP to copper, a three‐step process was proposed in this study. In the process, the surface of LCP was treated with oxygen plasma to create holes and increase the number of hydrophilic groups. The surface of copper was then oxidized and coated with silane coupling agent. Above surface treatment aimed to introduce amine group to facilitate the interconnection between copper and LCP and improve the surface roughness of the copper surface. The final samples were laminated by the above treated copper and LCP. In this study, different oxidation conditions were explored to analyze the morphology and composition of the copper surface after oxidation. The maximum peel strength of the sample prepared by this process was 8.92 N cm−1. This developed process can effectively reduce product thickness compared to current methods in industry and can reduce lamination temperature compared to previous studies.

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Section: Introductionmentioning

confidence: 65%

Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating

Chen

Feng

et al. 2022

J of Applied Polymer Sci

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“…11 Cyclo-olefin polymers (COPs) are gaining attention as low Dk polymers. 12 A representative commercial COP, such as ZEONOR (Zeon Corporation), is synthesized from ringopening polymerization of norbornenes, which generate a lowpolarity cyclopentane ring in the polymer main chain. As a result, COPs have a Dk of 2.3, significantly superior to those of epoxy and aromatic polymers.…”

Section: Introductionmentioning

confidence: 99%

Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

Fukata,

Kimura,

Iwata

2024

ACS Appl. Polym. Mater.

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We aimed to produce biomass-based plastics derived from polysaccharides for use in electrical devices, such as printed circuit boards (PCBs). We systematically investigated the combination of polysaccharides and side chain structures to achieve specific properties, notably a high glass transition temperature (T g ), for processes like soldering, and a low dielectric constant (Dk) to minimize electrical transmission loss. Three polysaccharides were selected as backbone structures: cellulose (β-1,4-glucan), paramylon (β-1,3-glucan), and α-1,3-glucan. Three types of side chain structures were then introduced: linear, branched, and cyclic, leading to 40 derivatives. Among them, α-1,3-glucan with cyclohexane carboxylate side chains exhibited the most promising properties combining high T g : 205 °C and low Dk: 2.7. Additionally, improving the crystallinity resulted in a further reduction of Dk to 2.5. The high T g and low Dk properties were comparable to, or surpassed, those of conventional polymers used in PCBs, such as epoxy and polyimide (>200 °C, 3−4). Polysaccharide esters are therefore another viable option as insulating polymers in electrical devices.

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“…Among olefins, cyclic olefin copolymer (COC) has an ultra-low D k of 2.21 and an ultra-low D f of 0.00021 at 10 GHz. Therefore, blending COC with PB would be an effective method to reduce the D f of the substrates [ 36 , 37 , 38 , 39 ].…”

Section: Introductionmentioning

confidence: 99%

Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates

et al. 2022

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The rapid development of the 5G communication technology requires the improvement of the thermal stability and dielectric performance of high-frequency copper clad laminates (CCL). A cyclic olefin copolymer (COC) resin was added to the original 1,2-polybutadienes (PB)/styrene ethylene butylene styrene (SEBS) binary resin system to construct a PB/SEBS/COC ternary polyolefin system with optimized dielectric properties, mechanical properties, and water absorption. Glass fiber cloths (GFCs) and SiO2 were used to fill the resin matrix so to reduce the thermal expansion coefficient (CTE) and enhance the mechanical strength of the composites. It was found that the CTE of polyolefin/GFCs/SiO2 composite laminates decreased with the increase of SiO2 loading at first, which was attributed to the strong interfacial interaction restricting the segmental motion of polymer chains between filler and matrix. It was obvious that the addition of COC and SiO2 had an effect on the porosity, as shown in the SEM graph, which influenced the dielectric loss (Df) of the composites directly. When the weight of SiO2 accounted for 40% of the total mass of the composites, the laminates exhibited the best comprehensive performance. Their CTE and Df were reduced by 63.3% and 22.0%, respectively, and their bending strength increased by 2136.1% compared with that of the substrates without COC and SiO2. These substrates have a great application prospect in the field of hydrocarbon resin-based CCL.

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Cyclic olefin copolymer‐based copper clad laminate and the application for low loss broadband baluns

Cited by 6 publications

References 33 publications

Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating

Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating

Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates

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