D-Band and Terahertz Frontends for 6G Wireless Communications in SiGe BiCMOS Technologies

Kissinger, Dietmar

doi:10.1109/iws55252.2022.9977927

Cited by 6 publications

(4 citation statements)

References 29 publications

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“…T HE demand for higher system bandwidth in radar sensing and communication applications is increasing tremendously due to strong demands regarding higher target resolution [1]- [3] or broadband data transfer [4]- [7]. The trend is toward higher frequencies to achieve larger system bandwidth.…”

Section: Introductionmentioning

confidence: 99%

“…The upcoming sub-terahertz communication standard IEEE 802. 15.3d in the 300 GHz frequency band provides broadband communication channels for high data-rate exchange in close-proximity communications or intra-device links, thus system solutions have to be developed to utilize this standard [7], [12]. Due to small wavelengths at frequencies beyond 220 GHz, whole system-on-chip (SoC) solutions with receiver and transmitter chains, as well as integrated antennas can be developed [3], [6].…”

Section: Introductionmentioning

confidence: 99%

“…However, a bulky antenna has to be integrated into the expensive IC area, while offering poor radiation efficiency and, thus, low antenna gain due to the chips's naturally low substrate height in the BEOL stackup of the IC processes [14], [15]. This low antenna gain can be compensated for using dielectric lenses, or localized backside etching [1], [7], [16]. However, these techniques require complex system assembly technologies that will increase the system's costs.…”

Section: Introductionmentioning

confidence: 99%

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

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This paper presents a broadband low-loss fanin wafer level ball grid array (WLB) vertical through-moldvia (TMV) interconnect that enables highly integrated systemin-package (SiP) applications beyond 220 GHz. The dedicate advantage of the proposed approach is to further minimize the separation between package components (e.g., antenna in package (AiP)) and on-chip receiver or transmitter chain. To demonstrate the robustness of the TMV interconnect design, the necessity for co-simulation of the integrated circuit (IC) package and the IC itself during the package-design is shown. Therefore, an in-depth analysis of the suppression of parasitic mode oscillation inside silicon is carried out. Furthermore, the parasitic radiation loss at the TMV interconnect discontinuity is given and a verification of the proposed TMV due to high agreement of simulation and measurement results is demonstrated. The interconnect has been verified with a measured 10 dB return loss bandwidth of 38 GHz and a de-embedded insertion loss of less than 2.8 dB at 275 GHz, which enables a compact low-loss broadband signal transition from active IC components in the backend-of-line (BEOL) to passive components in package. Compared to fan-out WLB, the developed fanin WLB solution enables higher integration density of active and passive components with the shortest interconnects for minimal insertion loss. Thus, the proposed fan-in TMV packaging provides a very compact, easy-to-assemble and cost-efficient alternative for SiP designs for future broadband communication and sensing solutions.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…This is particularly important for applications like thin sheet measurements [3]. In current research, there are multiple examples of wideband signal generation in SiGe [4], [5], [6], [7], [8], [9], as well as first CMOS systems [10].…”

Section: Introductionmentioning

confidence: 99%

Ultra-Wideband Transceiver MMIC Tuneable From 74.1 GHz to 147.8 GHz in SiGe Technology

Vogelsang,

Bott,

Starke

et al. 2024

IEEE J. Microw.

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As the use of integrated radar sensors is becoming more common not only in traditional military and automotive but also in medical and industrial applications, the requirements for a radar sensor diversify. For some applications, bandwidth is critical, primarily defining the capability to distinguish targets. Mostly, varying the frequency of an oscillator in the mmWave and THz range is realized by tuning a dc voltage to a variable capacitance. While this is typical for integrated transceivers in silicon-germanium (SiGe) technology, the tunability of a single voltage-controlled oscillator (VCO) limits the bandwidth. This work presents an approach to overcome this limitation by using two simultaneously tuned VCOs combined with a mixer. The oscillators are tuned simultaneously in opposing directions, resulting in an ultra-wideband signal at the mixer's output. The resulting tuning range is the addition of both of the VCOs' respective tuning ranges. The transceiver is realized using the B11HFC SiGe technology, featuring VCOs at center frequencies of 52 GHz and 108 GHz, respectively. The transceivers' output with a center frequency of 111 GHz is continuously tunable over a range of 73.6 GHz (66%). Furthermore, the phase noise contributions from both VCOs along a receiver test are presented.

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Microstrip Array Antennas Packaged in Metal Fixture for 150 GHz Beamforming Applications

Kim,

Koh,

Kim

2024

Antennas Wirel. Propag. Lett.

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D-Band and Terahertz Frontends for 6G Wireless Communications in SiGe BiCMOS Technologies

Cited by 6 publications

References 29 publications

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Ultra-Wideband Transceiver MMIC Tuneable From 74.1 GHz to 147.8 GHz in SiGe Technology

Microstrip Array Antennas Packaged in Metal Fixture for 150 GHz Beamforming Applications

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