2013
DOI: 10.1080/00207543.2012.758393
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Daily scheduling of multi-pass lots at assembly and test facilities

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Cited by 11 publications
(11 citation statements)
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“…The full version of the AT model includes lot sequencing, changeovers, an accounting of lots running at time zero, multiple passes in a route and a range of temperature options for machine set-ups (see Bard et al 2013). Solutions are obtained with a GRASP, which, for convenience, is referred to as the 'optimization' approach in the remaining sections.…”
Section: Basic Planning Modelmentioning
confidence: 99%
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“…The full version of the AT model includes lot sequencing, changeovers, an accounting of lots running at time zero, multiple passes in a route and a range of temperature options for machine set-ups (see Bard et al 2013). Solutions are obtained with a GRASP, which, for convenience, is referred to as the 'optimization' approach in the remaining sections.…”
Section: Basic Planning Modelmentioning
confidence: 99%
“…Nevertheless, even with these simplifications the corresponding MIP requires a large amount of notation, and from a practical point of view, it is intractable. To find solutions, we use a modified version of the GRASP described in Bard et al (2013). The notation and basic AT model follows.…”
Section: Basic Planning Modelmentioning
confidence: 99%
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“…In a follow-on paper, Bard, Gao, Chacon, and Stuber (2013) presented an enhanced methodology for dealing with changeovers, setups at time zero, and the multi-pass requirements associated with a route. To decide on the best machine-tooling configurations and how to assign lots to machines, a three-phase heuristic was implemented.…”
Section: Introductionmentioning
confidence: 99%
“…These multiple-chip products (MCPs) require repetitive visits to assembly stages several times and machines undergo frequent setup changes to process different types of MCPs [6]. Since utilization of assembly stages in packaging facilities decreases due to the significant setup change time, research on scheduling packaging facilities is gaining increased attention [6]- [12]. Packaging of semiconductors typically includes wafer mount, wafer saw, die attach (DA), cure, wire bond (WB), and inspection processes [13].…”
Section: Introductionmentioning
confidence: 99%