Damage mechanics of electromigration induced failure

Basaran, Cemal; Lin, Mei-Hui

doi:10.1016/j.mechmat.2007.06.006

Cited by 71 publications

(26 citation statements)

References 42 publications

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“…Methods of experimental determination of the quantity u 0 have also been developed [85]. From equality (49) it follows that u 0 is the activation energy of a given material, which is by the order of magnitude equal to 1-10 eV per one particle or molecule (~10 2 -10 3 kJ/mol), i.e., the value that is close to the energy of interatomic bond rupture in the solid [88]. Its level doesn't depend on how the rupture is -mechanically, thermally or by their simultaneous action.…”

Section: Energy Theory Of Damage and Limiting Statesmentioning

confidence: 99%

Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Sosnovskiy¹,

Sherbakov

2016

Entropy

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Abstract:Mechanics from its side and thermodynamics from its side consider evolution of complex systems, including the Universe. Created classical thermodynamic theory of evolution has one important drawback since it predicts an inevitable heat death of the Universe which is unlikely to take place according to the modern perceptions. The attempts to create a generalized theory of evolution in mechanics were unsuccessful since mechanical equations do not discriminate between future and past. It is natural that the union of mechanics and thermodynamics was difficult to realize since they are based on different methodology. We make an attempt to propose a generalized theory of evolution which is based on the concept of tribo-fatigue entropy. Essence of the proposed approach is that tribo-fatigue entropy is determined by the processes of damageability conditioned by thermodynamic and mechanical effects causing to the change of states of any systems. Law of entropy increase is formulated analytically in the general form. Mechanothermodynamical function is constructed for specific case of fatigue damage of materials due to variation of temperature from 3 K to 0.8 of melting temperature basing on the analysis of 136 experimental results.

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Section: Energy Theory Of Damage and Limiting Statesmentioning

confidence: 99%

Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Sosnovskiy¹,

Sherbakov

2016

Entropy

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“…Various damage models have been proposed by many researchers to analyze the fracture behavior of metals (Gurson, 1975;Tvergaard, 1982;Tvergaard and Needleman, 1984;Cockcroft and Latham, 1968;Johnson and Cook, 1985;Basaran and Lin, 2008;Wierzbicki et al, 2005;Beese et al, 2010;Xue, 2009;Zhang et al, 2000;Wilkins et al, 1980;Stoughton and Yoon, 2010). Cockcroft and Latham (1968) As mentioned in section 1, the damage studies can be classified into two main approaches.…”

Section: Damage Evolution Modelsmentioning

confidence: 99%

Necking behavior of AA 6022-T4 based on the crystal plasticity and damage models

Kim

Yoon

2015

International Journal of Plasticity

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“…Table 1. The electromigration parameters of 63Sn37Pb and 95SnAg4.5Cu0.5 solder bump can be found in references [5], [7], [9][10][11][12][13]. CSP structure under high current density can be calculated based the method in our prious work [5].…”

Section: A Csp Package Systemmentioning

confidence: 99%

Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system

Zhang

Chen

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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This paper proposes a parametric simulation plan for UBM geometry with different UBM rim angles, diameters and thicknesses. The parameter plan for the solder bump with different heights and diameters, and different shapes is also investigated. The goal of this study is to understand the impact of the die shrinkage on solder joint reliability under electromigration failure, and to optimize the UBM and solder bump shapes to reduce the damage of electromigration. A multiple physics finite element method for electromigration which considers the atomic density gradient is presented to conduct the simulation.

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Damage mechanics of electromigration induced failure

Cited by 71 publications

References 42 publications

Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Necking behavior of AA 6022-T4 based on the crystal plasticity and damage models

Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system

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