Damping Enhancement in Printed Circuit Boards With Potting Materials or Microfibrous Metallic Cloth

Abstract

As a result of the relatively low intrinsic damping in printed circuit boards, vibration and shock loading may excite vibration modes that lead to vibration-induced damage of the PCB and attached components. An investigation of techniques to enhance the damping in printed circuit boards is conducted. Experimental evaluation of the effects of several damping treatments was performed. Of particular interest were the effects of potting materials and microfibrous metallic cloth sandwich configurations. The results from different configurations for each type of treatment are compared and the results discussed. An overall summary of the results is presented and conclusions/observations are discussed.

Microfibrous metallic cloth for damping enhancement in printed circuit boards

“…The composites have been found to be very useful in chemical electrode applications where two seemingly incompatible materials are combined to obtain mutually beneficial properties [15]. There is considerable intermingling of the various fibers, providing considerable contact area between the respective fiber strands and voids between the fibers, enhancing both damping and compliance of such materials [17]. Proc.…”

Study on Vibration and Damping of Printed Circuit Boards Treated with Partial Constrained Damping Layer

“…Vibration and shock loading may lead to vibration-induced damage of the PCB and attached components. To satisfy the requirement of high performance and increase the reliability of electronic equipments as they were used in real environments, the structural vibration level of PCB has to be reduced by active or passive treatments [2].…”