2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.85
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Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology

Min Miao
1
,
Zhensong Li
2
,
Xiaoyang Duan
3
et al.
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Cited by 2 publications
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