2013
DOI: 10.1049/mnl.2013.0044
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DC-contact radio-frequency microelectromechanical system symmetric toggle switch on a borofloat substrate

Abstract: Presented is a DC-contact radio-frequency (RF) microelectromechanical system symmetric toggle switch for broadband power applications. Based on the lever principle, the proposed switching structure can be toggled upwards with extra restoring force using push electrodes. This push mechanism greatly improves the isolation and efficiently avoids the down-state stiction of the contacts which leads to enhancement of the power-handling capability. The measured actuated voltage is 33.4 V and the contact resistance of… Show more

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Cited by 5 publications
(2 citation statements)
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“…The RF MEMS switch was an essential component for the miniaturization of reconfigurable attenuator. The compact, high performance, Au-Au contact series of RF MEMS switches, which were described in an earlier work [16], were integrated into the present 3-bit step attenuator. The switches were based on simple cantilever structure with an electrostatic actuation voltage of 20-30 V. From DC to 40 GHz, the switches exhibited excellent performance, with insertion loss and isolation better than 0.5 dB and 19 dB, respectively.…”
Section: Rf Mems Switch Designmentioning
confidence: 99%
“…The RF MEMS switch was an essential component for the miniaturization of reconfigurable attenuator. The compact, high performance, Au-Au contact series of RF MEMS switches, which were described in an earlier work [16], were integrated into the present 3-bit step attenuator. The switches were based on simple cantilever structure with an electrostatic actuation voltage of 20-30 V. From DC to 40 GHz, the switches exhibited excellent performance, with insertion loss and isolation better than 0.5 dB and 19 dB, respectively.…”
Section: Rf Mems Switch Designmentioning
confidence: 99%
“…The switch was fabricated on a four‐inch low‐loss Borofloat glass wafer covered by a 500 nm thick SiO 2 layer using the Tsinghua University metal‐contact switch process as shown in Fig. 4 [15]. First, a 400 nm thick Si 3 N 4 layer was deposited and patterned using the dry‐etching process to define the contact dimples (Fig.…”
Section: Fabricationmentioning
confidence: 99%