Solution-based nanoparticle assembly
represents a highly
promising
way to build functional metastructures based on a wealth of synthetic
nanomaterial building blocks with well-controlled morphology and crystallinity.
In particular, the involvement of DNA molecular programming in these
bottom-up processes gradually helps the ambitious goal of customizable
chemical nanofabrication. However, a fundamental challenge is to realize
strong interunit coupling in an assembly toward emerging functions
and applications. Herein, we present a unified and clean strategy
to address this critical issue based on a H2O2-redox-driven “assembly and healing” process. This
facile solution route is able to realize both capacitively coupled
and conductively bridged colloidal boundaries, simply switchable by
the reaction temperature, toward bottom-up nanoplasmonic engineering.
In particular, such a “green” process does not cause
surface contamination of nanoparticles by exogenous active metal ions
or strongly passivating ligands, which, if it occurs, could obscure
the intrinsic properties of as-formed structures. Accordingly, previously
raised questions regarding the activities of strongly coupled plasmonic
structures are clarified. The reported process is adaptable to DNA
nanotechnology, offering molecular programmability of interparticle
charge conductance. This work represents a new generation of methods
to make strongly coupled nanoassemblies, offering great opportunities
for functional colloidal technology and even metal self-healing.