Interlayer defects in a three-dimensionally (3D) printed structure are expected from the residual stress and commonly observed warpage, but their detection has been challenging and elusive. They are to be distinguished from intralayer defects (e.g., discernible voids), which can be quite easily detected. Interlayer defects in the form of local inadequate interlayer bonding in a 3D-printed polymer structure have been unprecedentedly shown in this work to be detectible by capacitance measurement. The interlayer defects are artificially obtained and judiciously positioned. The printing involves conventional stereolithography, using an acrylate resin. Two coplanar electrical contacts are positioned on the exterior surface of the structure. The capacitance decreases monotonically with increasing number of defects at a given layer, and with decreasing N, where N is the number of layers above the defect, thus providing an effective indicator of the presence and location defects. However, the capacitance can be the same for different numbers of defects if N is different. This issue may be circumvented in future work by having additional electrical contacts at various layers. The maximum value of N that allows capacitance-based defect detection exceeds 210. The fractional decrease in capacitance due to the defects (relative to the case of no defect) increases monotonically with increasing number of defects at a given layer, but it essentially does not vary with N. Thus, the fractional decrease in capacitance indicates the presence of defects, but is not an effective indicator of the defect location. The capacitance increases with N, due to the larger depth of penetration of the current when N is higher. The greater is the number of defects at a layer, the more is the reduction in the depth of current penetration by these defects. The technique of this work may be extended to the detection of the 3D positions of defects by capacitance tomography.