Deep etching of Zerodur glass ceramics in a fluorine-based plasma

Weigel, C.; Schulze, M.; Gargouri, Hassan; Hoffmann, Martin

doi:10.1016/j.mee.2017.10.013

Cited by 9 publications

(17 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As mentioned before, plasma etching of fused silica and Zerodur were demonstrated as published elsewhere. [ 11,13,14 ] The reported optimized etching conditions served within our studies as the starting point to explore as well the deep etching of ULE 7972 that enabled simultaneously a comparative investigation of the impact of certain material properties. The process parameters used in this article are shown in Table 1 .…”

Section: Resultsmentioning

confidence: 99%

“…Substrate‐based fabrication with an accuracy in a single‐digit micrometer range and the respective reproducibility can be achieved by using high‐resolution UV lithography and deep reactive ion etching as already demonstrated in complex glass and glass ceramics. [ 10,11 ] Nanoimprint techniques in combination with reactive ion etching can be used as well if highly ordered glass nanostructures are targeted. [ 12 ]…”

Section: Introductionmentioning

confidence: 99%

“…Recent investigations underlined that the etching of a glass (ceramics) depends strongly on its chemical and structural composition but as well on its thermal properties. [ 10,11,14 ] Highly anisotropic etching with almost vertical sidewalls and etch depths larger than 100 μm were demonstrated for fused silica, which can, therefore, serve as a reference. [ 13 ] In particular, an etch rate of 300 nm min −1 and a selectivity of 20:1 with respect to the nickel hard mask as well as an overall low defect density were achieved.…”

Section: Introductionmentioning

confidence: 99%

“…[ 13 ] High etch rates of about 250 nm min −1 were achieved for Zerodur too with an etching gas composition of SF 6 or SF 6 /Ar, but the sidewall angle was only 71° for the considered processes, which was traced back to nonvolatile reaction products. [ 11,14 ] This fact obstructs significantly the achievable aspect ratio of etched structures and thus the reachable etch depth. The amount of nonvolatile reaction products differs for each type of glass.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass

et al. 2021

Self Cite

View full text Add to dashboard Cite

Deep etching of glass and glass ceramics is far more challenging than silicon etching. For thermally insensitive microelectromechanical and microoptical systems, zero‐expansion materials such as Zerodur or ultralow expansion (ULE) glass are intriguing. In contrast to Zerodur that exhibits a complex glass network composition, ULE glass consists of only two components, namely, TiO2 and SiO2. This fact is highly beneficial for plasma etching. Herein, a deep fluorine‐based etching process for ULE 7972 glass is shown for the first time that yields an etch rate of up to 425 nm min−1 while still achieving vertical sidewall angles of 87°. The process offers a selectivity of almost 20 with respect to a nickel hard mask and is overall comparable with fused silica. The chemical surface composition is additionally investigated to elucidate the etching process and the impact of the tool configuration in comparison with previously published etching results achieved in Zerodur. Therefore, deep and narrow trenches can be etched in ULE glass with high anisotropy, which supports a prospective implementation of ULE glass microstructures, for instance, in metrology and miniaturized precision applications.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass

et al. 2021

Self Cite

View full text Add to dashboard Cite

show abstract

“…For visible wavelength both monolith Y 2 O 3 and MgAl 2 O 4 are transparent, while YM is opaque owing to scattering caused not by pores but mismatch in refractive index between Y 2 O 3 and MgO. Meanwhile, the evaluation of plasmaresistance remains both unclear and controversial 4,36 . Accordingly, another way to characterize the etching behavior is to profile the etched.…”

Section: Resultsmentioning

confidence: 99%

Remarkable plasma-resistance performance by nanocrystalline Y2O3·MgO composite ceramics for semiconductor industry applications

Park

Kim

et al. 2021

Sci Rep

View full text Add to dashboard Cite

Motivated by recent finding of crystallographic-orientation-dependent etching behavior of sintered ceramics, the plasma resistance of nanocrystalline Y2O3-MgO composite ceramics (YM) was evaluated for the first time. We report a remarkably high plasma etching resistance of nanostructure YM surpassing the plasma resistance of commercially used transparent Y2O3 and MgAl2O4 ceramics. The pore-free YM ceramic with grain sizes of several hundred nm was fabricated by hot press sintering, enabling theoretical maximum densification at low temperature. The insoluble two components effectively suppressed the grain growth by mutual pinning. The engineering implication of the developed YM nanocomposite imparts enhanced mechanical reliability, better cost effectiveness with excellent plasma resistance property over their counterparts in plasma using semiconductor applications.

show abstract

Ultralow Expansion Glass as Material for Advanced Micromechanical Systems

et al. 2023

Self Cite

View full text Add to dashboard Cite

Ultralow expansion (ULE) glasses are of special interest for temperature stabilized systems for example in precision metrology. Nowadays, ULE materials are mainly used in macroscopic and less in micromechanical systems. Reasons for this are a lack of technologies for parallel fabricating high‐quality released microstructures with a high accuracy. As a result, there is a high demand in transferring these materials into miniaturized application examples, realistic system modeling, and the investigation of microscopic material properties. Herein, a technological base for fabricating released micromechanical structures and systems with a structure height above 100 μm in ULE 7972 glass is established. Herein, the main fabrication parameters that are important for the system design and contribute thus to the introduction of titanium silicate as material for glass‐based micromechanical systems are discussed. To study the mechanical properties in combination with respective simulation models, microcantilevers are used as basic mechanical elements to evaluate technological parameters and other impact factors. The implemented models allow to predict the micromechanical system properties with a deviation of only ±5% and can thus effectively support the micromechanical system design in an early stage of development.

show abstract

Deep etching of Zerodur glass ceramics in a fluorine-based plasma

Cited by 9 publications

References 12 publications

Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass

Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass

Remarkable plasma-resistance performance by nanocrystalline Y2O3·MgO composite ceramics for semiconductor industry applications

Ultralow Expansion Glass as Material for Advanced Micromechanical Systems

Contact Info

Product

Resources

About