2012
DOI: 10.1143/apex.5.122101
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Deep-Ultraviolet Light-Emitting Diodes Fabricated on AlN Substrates Prepared by Hydride Vapor Phase Epitaxy

Abstract: AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) were fabricated on AlN substrates. The AlN substrates were prepared by growing thick hydride vapor phase epitaxy (HVPE)-AlN layers on bulk AlN substrates prepared by physical vapor transport (PVT). After growing an LED structure, the PVT-AlN substrates were removed by mechanical polishing. This process allowed the fabrication of DUV-LEDs on HVPE-AlN substrates with high crystalline quality and DUV optical transparency. The DUV-LEDs exhibited a singl… Show more

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Cited by 127 publications
(89 citation statements)
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“…AlN substrate fabrication by hydride vapor-phase epitaxy (HVPE) can significantly reduce the optical absorption when compared with that of typical AlN substrates fabricated by physical vapor transport (PVT) with an absorption coefficient of 35 cm À1 , 7 but HVPE-AlN substrates still show inescapable absorption losses, with an absorption coefficient of approximately 10 cm À1 at a wavelength of approximately 265 nm. 10 Therefore, a trade-off exists between the dislocation density and light extraction. Additionally, early power saturation (i.e., efficiency droop) at high injection current densities is a common problem in flip-chip mesa-type DUVLEDs.…”
mentioning
confidence: 99%
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“…AlN substrate fabrication by hydride vapor-phase epitaxy (HVPE) can significantly reduce the optical absorption when compared with that of typical AlN substrates fabricated by physical vapor transport (PVT) with an absorption coefficient of 35 cm À1 , 7 but HVPE-AlN substrates still show inescapable absorption losses, with an absorption coefficient of approximately 10 cm À1 at a wavelength of approximately 265 nm. 10 Therefore, a trade-off exists between the dislocation density and light extraction. Additionally, early power saturation (i.e., efficiency droop) at high injection current densities is a common problem in flip-chip mesa-type DUVLEDs.…”
mentioning
confidence: 99%
“…The MOCVD, HVPE, and LED processing techniques have been described in detail elsewhere. 9,10,13 From bottom to top, the LED structures are composed of a 100-nm-thick AlN homoepitaxial layer, a 1-lm-thick Si-doped n-Al 0.75 Ga 0.25 N layer, three multiple quantum well (MQW) active layers, a Mg-doped p-AlN electron blocking layer, a p-Al 0.8 Ga 0.2 N cladding layer, and a p-GaN contact layer. We enlarged the emitting area to enhance the output power by reducing the current density.…”
mentioning
confidence: 99%
“…By using HVPE-AlN as a substrate for growth and subsequent removal of it by mechanical polish, an output power of 28 mW and an EQE of 2.4% were obtained at an injection current of 250 mA in 268 nm DUV LEDs. [55] In another study, TDD in 261 nm DUV LED heterostructures (except the p-GaN layer) grown on HVPE-AlN/PVT-AlN substrates was found to be below 10 6 cm -2 from transmission electron microscopy (TEM) analysis. The lifetime of these LEDs was estimated to be over 10,000 h for CW operation at 50 mA, and over 5,000 h for CW operation at 150 mA.…”
Section: Growth and Optical Properties Of Bulk Aln For Duv Ledsmentioning
confidence: 97%
“…To avoid this, pseudomorphic growth of high Al-molar fraction AlGaN with compressive strain on AlN has been developed. [55,83,84] Because almost no new defects are generated in the pseudomorphic region, the crystalline quality of the AlGaN-based heterostructures becomes comparable to the starting substrate.…”
Section: Pseudomorphic Growth Of High Al-molar Fraction Algan On Alnmentioning
confidence: 99%
“…Furthermore, AlN has promising applications in surface acoustic wave devices (SAW) and microelectromechanical systems (MEMS) due to its high acoustic velocity and piezoelectric properties [2], which are maintained at high temperatures [3,4]. The most attractive perspective for AlN-base devices is in the field of deep-ultraviolet light-emitting diodes working at extremely short wavelengths [5]. For this last application, the most serious challenge is the reduction of defect density in thin films grown on foreign substrates, which limits both efficiency and reliability of the devices [6,7].…”
Section: Introductionmentioning
confidence: 99%