1986
DOI: 10.1016/0168-583x(86)90062-5
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Defect and dopant depth profiles in boron-implanted silicon studied with channeling and nuclear reaction analysis

Abstract: Single crystals of silicon were implanted at RT with 1 MeV boron ions to a dose of 1 X 10 l5 ions/cm2. The depth profile of the boron was measured using the 2060-keV resonance of the "B(a n)14N nuclear reaction. The distribution of the lattice disorder as a , function of depth was determined from channeling of MeV a-particles. This was done in the as-implanted case and after furnace annealing at temperatures up to 1000°C. A short description of the applied techniques is presented. The crystal disorder was foun… Show more

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Cited by 11 publications
(3 citation statements)
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“…Experiments on the influence of UST on diffusion should be performed with light atoms. In this case only single point defects are created along the ion tracks without a significant overlap of damaged regions [12,13]. Our experiments with boron implantation under UST show that the removal of the most mobile interstitial atoms from the implanted region leads to decreasing densities of scattering centres (figure 4, curves 2 and 3).…”
Section: Discussionmentioning
confidence: 76%
“…Experiments on the influence of UST on diffusion should be performed with light atoms. In this case only single point defects are created along the ion tracks without a significant overlap of damaged regions [12,13]. Our experiments with boron implantation under UST show that the removal of the most mobile interstitial atoms from the implanted region leads to decreasing densities of scattering centres (figure 4, curves 2 and 3).…”
Section: Discussionmentioning
confidence: 76%
“…The size of these defects is ~10 nm and concentration is near 10 12 cm -2 . The dechanneling probability due to the dislocation loops which arise after implanted sample annealing, increases [8]. For implanted samples with US-treatment, the concentration of these defects is lower, because part of more mobile interstitials diffuses into bulk of silicon.…”
Section: Discussionmentioning
confidence: 99%
“…To estimate the cross section σ D (φ 1/2 ) one uses the Rutherford differential scattering cross section and integrates from φ 1/2 to ∞. It should also be noted that different procedures to determine the beam dechanneled fraction has been used in the work [8], where damage depth profile of B-implanted single crystals of silicon has been studied too. Fig.…”
Section: Methodsmentioning
confidence: 99%