2004
DOI: 10.1016/j.jcrysgro.2004.01.063
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Defect characterization for epitaxial HgCdTe alloys by electron microscopy

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Cited by 43 publications
(33 citation statements)
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“…54,55 These defects can nucleate at any depth, and occur with different sizes. A summary of an associated nanospectroscopy study was given by Aoki et al 22 Other kinds of voids are caused by dust particles left on the surface by, or in spite of, the substrate cleaning process, such as contaminated deionized water. 39,56,57 Flakes dropping from the chamber wall during growth, substrate mounting, substrate transferring between chambers, and/or from the Hg or other cells can also trigger the formation of voids of any size.…”
Section: Resultsmentioning
confidence: 99%
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“…54,55 These defects can nucleate at any depth, and occur with different sizes. A summary of an associated nanospectroscopy study was given by Aoki et al 22 Other kinds of voids are caused by dust particles left on the surface by, or in spite of, the substrate cleaning process, such as contaminated deionized water. 39,56,57 Flakes dropping from the chamber wall during growth, substrate mounting, substrate transferring between chambers, and/or from the Hg or other cells can also trigger the formation of voids of any size.…”
Section: Resultsmentioning
confidence: 99%
“…10,22,23 Within a surface crater defect, crystals of both HgCdTe and Te continue to nucleate, with the HgCdTe grains being either semicoherent or incoherent to the Te grains. 10 Energy-dispersive X-ray spectroscopy (EDS) data also confirmed the existence of excessive Te in the surface crater defects (Fig.…”
Section: Resultsmentioning
confidence: 99%
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“…7 ACEMs, which are capable of pushing information limits to beyond the 1.0-Å level, have since become available, so that projected atomic columns can be resolved in all zincblende compound semiconductors for observation in this viewing direction. 8 Specimen damage during the process of ion milling is well known to be a problematic issue when preparing cross-sections of II-VI semiconductors for TEM observation, and can easily lead to erroneous interpretation of defect microstructure; 9 For example, argon-ion milling was shown to cause {111}-type stacking-fault dislocation loops, which could however be effectively eliminated by instead using reactive iodine milling (albeit also accompanied by greatly increased damage to components of the vacuum system). 10 In the case of HgCdTe alloys, it was shown that the amount of ion-induced damage could be markedly reduced by milling at low glancing angles and with lower-energy (<2 keV) ion beams, and with the sample cooled to liquid-nitrogen temperature.…”
Section: Introductionmentioning
confidence: 99%