2008
DOI: 10.1016/j.jcrysgro.2007.10.019
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Defect dynamics in the presence of nitrogen in growing Czochralski silicon crystals

Abstract: Many crystallographic imperfections termed microdefects form in silicon crystals during their Czochralski growth. These are the aggregates of vacancies, of self-interstitials, or of oxygen (silicon dioxide). The distribution of microdefects can be strongly influenced and controlled by the addition of impurities such as nitrogen to the crystal. A model describing the Czochralski defect dynamics in the presence of nitrogen and oxygen is proposed and solved. The reactions between vacancies and self-interstitials,… Show more

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Cited by 19 publications
(35 citation statements)
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“…Free and bound (VO and VO 2 ) vacancies are expended initially on the formation of microvoids (1223 K< T 1423 K) and then are expended on the formation of Oclusters (precipitates of oxygen) at T < 1223 K [42]. Exactly the same approach applies to nitrogen impurity with similar results of calculations [43]. In the articles [42,43] ignored the effect of impurities on the formation of interstitial grown-in microdefects.…”
Section: Physical Modelingmentioning
confidence: 85%
“…Free and bound (VO and VO 2 ) vacancies are expended initially on the formation of microvoids (1223 K< T 1423 K) and then are expended on the formation of Oclusters (precipitates of oxygen) at T < 1223 K [42]. Exactly the same approach applies to nitrogen impurity with similar results of calculations [43]. In the articles [42,43] ignored the effect of impurities on the formation of interstitial grown-in microdefects.…”
Section: Physical Modelingmentioning
confidence: 85%
“…The presence of nitrogen affects strongly the kind and distribution of such oxygen-containing microdefects; only small oxygen-containing clusters are formed at processing of Cz-Si:N [2]. Similarly as in the case of nitrogen-lean Cz-Si, clustering/precipitation of O i 's in Cz-Si:N at enhanced temperatures (HT) depends also on hydrostatic pressure (HP) applied at processing [3].…”
Section: Introductionmentioning
confidence: 99%
“…After the formation of microvoids, the aforementioned complexes grow and take up vacancies. This model has ignored the growth of the complexes by means of the injection of intrinsic interstitial silicon atoms and the interaction of an impurity with intrinsic interstitial silicon atoms (Kulkarni 2007;2008b).In the general case recombination-diffusion model assumes that the process of defect formation in dislocation-free silicon single crystals occurs in four stages: (i) fast recombination of intrinsic point defects near the crystallization front; (ii) the formation in the narrow temperature range 1423...1223 K depending on the value of V g /G microvoids or interstitial dislocation loops; (iii) the formation of oxygen clusters in the temperature range 1223...1023 K; (iv) growth of precipitates as a result of subsequent heat treatments.Recombination-diffusion model is the physical basis for models of the dynamics of point defects. The mathematical model of point defect dynamics in silicon quantitatively explains the homogeneous mechanism of formation of microvoids and dislocation loops.…”
mentioning
confidence: 99%
“…al., 2004). R e c e n t v e r s i o n s o f t h i s m o d e l h a v e s u g g e s t e d t h a t p a r t o f t h e v a c a n c i e s ( v ) i n t h e temperature range 1683 ... 1373 K, due to the interaction with oxygen (O) and nitrogen (N) impurities, are bound into complexes of the vO, vO 2 , and vN types (Kulkarni 2007;2008b). After the formation of microvoids, the aforementioned complexes grow and take up vacancies.…”
mentioning
confidence: 99%
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