2012
DOI: 10.1111/j.1551-2916.2012.05420.x
|View full text |Cite
|
Sign up to set email alerts
|

Defect Healing and Cracking in Ceramic Films During Constrained Sintering

Abstract: Cracking is a major problem during constrained sintering of ceramic films. A local variation of density in a green film, referred to as a defect in this work, is the leading cause for cracking. This article presents analytical and numerical studies of the behavior of such defects during constrained sintering. An interesting behavior of de-sintering and healing of the defects is revealed. It is demonstrated that the healing process can be made to start earlier during sintering by using (a) larger particles, (b)… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
12
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
5
1
1

Relationship

0
7

Authors

Journals

citations
Cited by 11 publications
(12 citation statements)
references
References 29 publications
0
12
0
Order By: Relevance
“…[19][20][21][22] Under constrained conditions a slower densification rate and generation of processing defects have been observed in thick-film structures. Since the bulk ceramic shrinks isotropically in all three directions, the layer shrinks exclusively in the direction perpendicular to the substrate.…”
Section: Drying and Densificationmentioning
confidence: 99%
“…[19][20][21][22] Under constrained conditions a slower densification rate and generation of processing defects have been observed in thick-film structures. Since the bulk ceramic shrinks isotropically in all three directions, the layer shrinks exclusively in the direction perpendicular to the substrate.…”
Section: Drying and Densificationmentioning
confidence: 99%
“…However, the development of stresses in the thick films due to the constrained sintering conditions can hinder the densification, and results in the formation of defects and/ or the delamination of the thick films from the substrates. [8][9][10][11] To date, the prevailing piezoelectric ceramics are leadbased compositions, thanks to their reproducible processing and good functional properties. However, due to environmental and health concerns, lead-free materials, such as sodium potassium niobate-based compositions (K 0.5 Na 0.5 NbO 3 , KNN) have been intensively investigated as a potential alternative to lead-based materials.…”
Section: Introductionmentioning
confidence: 99%
“…The as‐deposited layers are subsequently fired at elevated temperature to consolidate and to develop the desired microstructure of the thick film. However, the development of stresses in the thick films due to the constrained sintering conditions can hinder the densification, and results in the formation of defects and/or the delamination of the thick films from the substrates 8‐11 …”
Section: Introductionmentioning
confidence: 99%
“…Because of the sintered substrate, shrinkage of the joint LTCC tapes is constrained in the x – y plane which leads to stress formation in the latter . These stresses can cause defects such as crack formationor cavity formation along the printed circuit lines between the LTCC layers. These defects and their origins as well as the influence of different screen‐printed layouts on the quality of the sintered laminates will be discussed.…”
Section: Introductionmentioning
confidence: 99%