Defect inspection challenges and solutions for ultra-thin SOI

Brun, Roland; Moulin, C.; Schwarzenbach, W.; Bast, Gerhard; Aristov, V. Yu.; Belyaev, Alexander

doi:10.1109/asmc.2012.6212870

Cited by 8 publications

(9 citation statements)

References 1 publication

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“…Therefore, defects on the surface need to be inspected. [1][2][3] Optical microscopy is widely used as the inspection system. [1][2][3] In general, inspection systems require both high sensitivity and throughput.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3] Optical microscopy is widely used as the inspection system. [1][2][3] In general, inspection systems require both high sensitivity and throughput. When those defects are much smaller than the resolution of the optical system, darkfield microscopy is often used because of its high throughput.…”

Section: Introductionmentioning

confidence: 99%

“…When those defects are much smaller than the resolution of the optical system, darkfield microscopy is often used because of its high throughput. [1][2][3] With dark-field microscopy, the laser is irradiated on the surface and scattered light from defects is detected. The scattered light is very weak and anisotropic.…”

Section: Introductionmentioning

confidence: 99%

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Development of pupil divided optics with magnification correction for high NA oblique imaging

Arima

Urano

Honda

et al. 2022

Jpn. J. Appl. Phys.

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For manufacturing semiconductor devices and hard disks, a high-sensitivity and high-throughput inspection system is required to detect defects on the surface of semiconductor wafers or disk substrates. Dark-field optical microscopy with high-numerical-aperture detectors in oblique directions is often used to detect weak and anisotropic scattered light from small defects. With conventional high numerical aperture (NA) optics, it is difficult to image the wide field from an oblique direction because of its short depth of focus (DOF). Here, we propose a new optics called “pupil divided optics with magnification correction”. In this optics, a low NA cylindrical lens array (CLA) is placed on the pupil plane of the high NA objective lens to extend DOF. In this paper, we describe the theory and configuration of the proposed optics. Our simulation and experimental results show the capability for oblique imaging with wide field.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Development of pupil divided optics with magnification correction for high NA oblique imaging

Arima

Urano

Honda

et al. 2022

Jpn. J. Appl. Phys.

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“…By analyzing intensity distributions of the scattered lights from detects, physical properties of detects such as sizes or profiles can be verified. Meanwhile, the intensity of the scattered light would obey the Rayleigh scattering limitation (Brun, et al, 2012), and would decrease with a miniaturization of defects to be detected. Because of this reason, it is difficult to detect a defect whose size is smaller than 16 nm (International Technology Roadmap for Semiconductors, 2014).…”

Section: Introductionmentioning

confidence: 99%

“…Because of this reason, it is difficult to detect a defect whose size is smaller than 16 nm (International Technology Roadmap for Semiconductors, 2014). It is therefore desired to develop a new inspection method that can overcome the criterion of the detectable defect size, and many efforts have been made to establish a technology that can bring a breakthrough into the surface defect inspection (Brinksmeier, et al, 2010, Brun, et al, 2012.…”

Section: Introductionmentioning

confidence: 99%

Design of fabrication process of a thermal contact sensor for surface defect inspection

Shimizu

Ohba

Gao

2014

JAMDSM

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A fabrication process of a contact detection sensor, which is thermally-sensitive thin film sensor referred to as a thermal contact sensor to be used for a surface defect inspection, is designed based on photolithography process. The existence of a small defect, the size of which is on the order of several-ten nanometers, would be detected by capturing frictional heat generated at the contact between the thermal contact sensor and the defect. The thermal contact sensor is therefore designed to detect small quantity of frictional heat, the rate of heat supply of which is estimated to be on the order of microwatts. In this paper, followed by the fabrication of the first prototype thermal contact sensor in the previous study, the structure of the thermal contact sensor is modified to make the thermally-sensitive area of the thermal contact sensor to be located at its top surface. For further stable fabrication of a thermal contact sensor, lift-off process with a positive resist is also introduced in the sensor fabrication process. Experiments are carried out to verify the feasibility of the fabricated second prototype thermal contact sensor. In addition, aiming to improve sensitivity of the thermal contact sensor, the relationship between the sensor sensitivity and the sensor bias voltage is investigated in experiments. Furthermore, FEM simulation is carried out to estimate the increase of the sensor temperature due to a self-heating effect by the bias voltage applied to the thermal contact sensor, since the sensor temperature deviation could affect the sensitivity of the thermal contact sensor.

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Design and Testing of a Contact-Type Micro Thermal Sensor for Defect Inspection on Nanometric Smooth Surfaces

Shimizu

Ohba

Gao

2022

Proceedings of the 38th International MATADOR Conference

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Defect inspection challenges and solutions for ultra-thin SOI

Cited by 8 publications

References 1 publication

Development of pupil divided optics with magnification correction for high NA oblique imaging

Development of pupil divided optics with magnification correction for high NA oblique imaging

Design of fabrication process of a thermal contact sensor for surface defect inspection

Design and Testing of a Contact-Type Micro Thermal Sensor for Defect Inspection on Nanometric Smooth Surfaces

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