Defining an Optimized Machine Process Sequence to Address Broken Wafer Phenomenon on Semiconductor Products

Abstract

Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process during wafer preparation. Using a wafer taper machine, silicon wafers are covered by an industrial tape as preparation for the next process. During processing and wafers are placed on wafer boat, unexpected phenomenon of broken wafers due to unwanted falling was encountered. Findings was due to the unintentional dragging of the machine’s robot arm after wafer processing. The problem is resolved through simulation and experiments using statistical analysis. As a result, an optimized machine parameter setting was defined to eliminate the said rejection. Statistical analysis was of a big help in resolving the said phenomenon and improved the process yield of the manufacturing.