Defining defect specifications to optimize photomask production and requalification

Fiekowsky, Peter

doi:10.1117/12.706646

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…For this effort, based on the close relationship with customers, customers disclosed detailed exposure conditions for wafer printing, which enabled more accurate simulation, and resulted in provision of more reliable masks. [4] For effects of DFM (Design for Manufacturing), we are seeking for design optimization. By implementing MRC (Mask Rule Check) to customer data, a system has been established to feedback problems to customers and feed forward for mask manufacturing.…”

Section: Study On Inspection Process Modelmentioning

confidence: 99%

The study of defect inspection with die to model based on aerial image

2008

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Technical demand for the photomask is becoming severer along with super-miniaturization of the semiconductor patterns as shown in the ITRS roadmap. Defect inspection is especially becoming more challenging and difficult as the photomask design rules continue to shrink toward hp65-45nm and below. One of the factors for such difficulties is aggressive OPC (Optical Proximity Correction), which makes defect inspection extremely difficult. In lithography, ArF immersion lithography will be predominantly used as one of the powerful candidates for the technology for hp65-45nm. Therefore, we have to assure zero printable defects assuming the use of ArF immersion lithography. Recently, there is another issue of increase in mask production cost, causing QCD balance to start to collapse. To cope with this new problem, tool operation is being considered for inspections ranging from accelerating inspection in R&D phase to reasonable inspection in production phase. In this paper, inspection concept for operation of inspection tools in R&D and production phases is discussed, with special focus on the aerial image based inspection.

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Section: Study On Inspection Process Modelmentioning

confidence: 99%

The study of defect inspection with die to model based on aerial image

2008

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Photomask Defect Extraction by Using Difference between a Reference Image and a Test Image after Illumination Adjustment

Zheng

Ma²,

He³

2007

The 2007 International Conference on Intelligent Pervasive Computing (IPC 2007)

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A Security Framework for Secure Home Networking in Ubiquitous Computing

Lee¹,

Chae

Kim

et al. 2007

The 2007 International Conference on Intelligent Pervasive Computing (IPC 2007)

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Most security solutions and middleware on home network consider internet users as approaching subject. It is unrealistic where the most subjects are mobile users who want to control home network devices. Therefore minor and fast certification structures are needed to control other devices with mobile device that has lower computing capacity. To solve the above problems, this paper wants to build safe certification frame work for internet and mobile users to control household devices safely. New certification structure is proposed to get out of heavy certification structure like PKI and to minimize encrypting and decrypting operation by compounding session key and public key.

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Defining defect specifications to optimize photomask production and requalification

Cited by 4 publications

References 3 publications

The study of defect inspection with die to model based on aerial image

The study of defect inspection with die to model based on aerial image

Photomask Defect Extraction by Using Difference between a Reference Image and a Test Image after Illumination Adjustment

A Security Framework for Secure Home Networking in Ubiquitous Computing

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