2006 8th Electronics Packaging Technology Conference 2006
DOI: 10.1109/eptc.2006.342732
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Deformation and fatigue behaviour of AuSn interconnects

Abstract: The knowledge of deformation and fatige behaviour is vital for understanding reliability problems and builds the basis for mechanical simulations, which quantify strains, stresses and even product life-times. The focus of this paper is the AuSn interconnect in the form of eutectic AuSn and fine pitch flip-chip interconnects consisting in this example of an Au-phase and a zetha-phase. In the fist place local elasticplastic properties are analysed by nanoindentation giving information about the process influence… Show more

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Cited by 4 publications
(3 citation statements)
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“…Ag 3 Sn 96.5 Cu 0.5 and Au 80 Sn 20 solder bonding Generally, a strong mechanical joint is required to guarantee stable electrical interconnection between the top and bottom materials during the assembly as well as in the period of field operation. Therefore, a eutectic solder of lead-tin, silvertin, silver-tin-copper and a gold-tin is commonly used for soldering of microsystems such as optoelectronic, RF and MEMS packaging [17][18][19][20][21][22][23][24][25]. There have been several research studies on AgSn, AgSnCu, AuSn such as Ag-Sn electroplating (Ag-Sn meaning AgSn alloy), Ag/Sn electroplating (Ag/Sn meaning Sn electroplating on Ag electroplating), Ag/Sn evaporation, Ag-Sn-Cu paste, Au-Sn electroplating, Au/Sn plating and Au/Sn evaporation.…”
Section: Ni-co Electroplatingmentioning
confidence: 99%
“…Ag 3 Sn 96.5 Cu 0.5 and Au 80 Sn 20 solder bonding Generally, a strong mechanical joint is required to guarantee stable electrical interconnection between the top and bottom materials during the assembly as well as in the period of field operation. Therefore, a eutectic solder of lead-tin, silvertin, silver-tin-copper and a gold-tin is commonly used for soldering of microsystems such as optoelectronic, RF and MEMS packaging [17][18][19][20][21][22][23][24][25]. There have been several research studies on AgSn, AgSnCu, AuSn such as Ag-Sn electroplating (Ag-Sn meaning AgSn alloy), Ag/Sn electroplating (Ag/Sn meaning Sn electroplating on Ag electroplating), Ag/Sn evaporation, Ag-Sn-Cu paste, Au-Sn electroplating, Au/Sn plating and Au/Sn evaporation.…”
Section: Ni-co Electroplatingmentioning
confidence: 99%
“…Among these models, shear-lap specimen is the most popular one. SnAgCu-CNT solders under thermal cycles may include shear and creep deformation, while shear-lap prototype can monitor deformation and structural changes [5]. So this kind of model is widely used.…”
Section: Introductionmentioning
confidence: 99%
“…4, right) shows, that the formerly voids build oxide layers as an almost continuous gap. Even if the heat can dissipate across this gap it is a high mechanical reliability risk [7].…”
Section: Fig 2 Ausn Phase Diagrammentioning
confidence: 99%