“…For the relationship between the mold structure and the flow profile, Yong He etc [5] used the software DEFORM to study the effect of the mold duty ratio, ratio of the mold width to the polymer thickness, concave mold, convex mold and the non-symmetric mold on the polymer flow profile, and proposed the strategy of topology optimization of mold structure to improve the polymer filling efficiency. Liu etc [6] investigated the deformation behavior of solid polymer during hot embossing process, the swallowtail deformation due to the incomplete filling occurred during the heating and applying pressure process, and reduced during the remaining temperature and pressure process, but the deformation behavior of solid polymer is not explained clearly in the rolling embossing process. Song Xiao etc [7] established a theoretical model based on the principle of electroosmosis-driven micro flow, and used COMSOL Multiphysics simulation software to reveal the feature patterns and the properties of polymer.…”