2010
DOI: 10.1016/j.mee.2009.07.014
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Deformation behavior of solid polymer during hot embossing process

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Cited by 54 publications
(29 citation statements)
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“…It has been reported that the elastic modulus of dry Nafion membranes drops from 300 MPa at 25°C to 2-3 MPa at 110°C [24,25]. However, even above T g (»140°C), certain polymers are known to display residual elastic behavior, leading to spring back during the imprinting processes at these temperatures [26][27][28]. In our case, this could account for the observed difference between mold height and feature depth in Nafion, imprinted at temperatures above T g .…”
Section: Device Aspects and Ocv Measurementmentioning
confidence: 99%
“…It has been reported that the elastic modulus of dry Nafion membranes drops from 300 MPa at 25°C to 2-3 MPa at 110°C [24,25]. However, even above T g (»140°C), certain polymers are known to display residual elastic behavior, leading to spring back during the imprinting processes at these temperatures [26][27][28]. In our case, this could account for the observed difference between mold height and feature depth in Nafion, imprinted at temperatures above T g .…”
Section: Device Aspects and Ocv Measurementmentioning
confidence: 99%
“…3a-d are 1000 m, 1000 m, 1500 m and 1700 m, respectively. The parameters of FEA can be found in our former works (Liu et al, 2010). In Fig.…”
Section: Effects Of Embedded Sacrificial Layer On Multilayer Bondingmentioning
confidence: 99%
“…For the relationship between the mold structure and the flow profile, Yong He etc [5] used the software DEFORM to study the effect of the mold duty ratio, ratio of the mold width to the polymer thickness, concave mold, convex mold and the non-symmetric mold on the polymer flow profile, and proposed the strategy of topology optimization of mold structure to improve the polymer filling efficiency. Liu etc [6] investigated the deformation behavior of solid polymer during hot embossing process, the swallowtail deformation due to the incomplete filling occurred during the heating and applying pressure process, and reduced during the remaining temperature and pressure process, but the deformation behavior of solid polymer is not explained clearly in the rolling embossing process. Song Xiao etc [7] established a theoretical model based on the principle of electroosmosis-driven micro flow, and used COMSOL Multiphysics simulation software to reveal the feature patterns and the properties of polymer.…”
Section: Introductionmentioning
confidence: 99%