Deformation characteristics of Au wire bonding

Saiki, Hiroyuki; Nishitake, Hiroshi; Yotsumoto, Takahiro; Marumo, Yasuo

doi:10.1016/j.jmatprotec.2007.03.037

Cited by 13 publications

(8 citation statements)

References 9 publications

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“…This is because the capillary geometry affects the force vectors acting on the free air ball (FAB) and the compression of Au ball bonds, which consequently will produces different value of micromechanical properties across the Au ball bonds. Saiki et al [19] observed that the different value of micromechanical properties across the Au ball bond is due to strain hardening effect. The higher value of hardness of indentations at the periphery area is because the Au ball bonds that located at the periphery of capillary has experienced the highest strain hardening effect from the given force, while the Au ball bonds that located at the center of capillary has experienced the lowest strain hardening effect.…”

Section: Resultsmentioning

confidence: 99%

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

Zulkifli

Jalar

Abdullah

et al. 2016

KEM

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The evaluation of the strength and bondability of gold, Au ball bond requires a new approach to provide a more detail data. Nanoindentation test was used as a new approach to evaluate the strength distribution and bondability of Au ball. Au ball bonds that experienced different value of wire bonding parameter namely bonding force, bonding time, bonding power, and stage temperature were used as samples for the present analysis. The distribution of strength based on hardness and reduced modulus values located at the bonding area of Au ball bonds were found to be related with the values of the wire bonding parameter. Nanoindentation test was found to be a suitable approach to analyze and evaluate the bondability of Au ball bond in a localized and detailed manner. In addition, the responsible mechanism for the thermosonic Au wire bonding can be identified and analyzed by using the results obtained from the nanoindentation test.

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Section: Resultsmentioning

confidence: 99%

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

Zulkifli

Jalar

Abdullah

et al. 2016

KEM

View full text Add to dashboard Cite

show abstract

“…Wire-bonded contacts are commonly used in semiconductor components and represent the fact that even very small contact areas can be used for current flow and the high-volume production of electronics. Standardly-used wires have a diameter from 12.5 µm to 75 µm, and the contact area is in hundreds of µm 2 [57][58][59]. Considering the 30 µm diameter of silver-plated copper microwires in the hybrid conductive yarn and surface impurities in the form of silicone or paraffin lubrication for easier yarn fabrication, similar contact areas for thermo-compressed and wire-bonded contacts are expected.…”

Section: Theoretical Model Of Contact Resistancementioning

confidence: 99%

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

et al. 2023

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Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mΩ), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm’s model.

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“…Finite element analysis (FEA) has been used extensively by several researchers to analyse the plastic deformation that occurs during the wire bonding process [23][24][25][26]. Saiki et al [23] investigated the effect of capillary tip shape on ball bonding using finite element analysis.…”

Section: Finite Element Analysismentioning

confidence: 99%

“…Saiki et al [23] investigated the effect of capillary tip shape on ball bonding using finite element analysis. They found that the amount of sliding of the ball bond increases with decreasing capillary tip angle.…”

Section: Finite Element Analysismentioning

confidence: 99%

Some thoughts on bondability and strength of gold wire bonding

et al. 2012

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The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved.

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Deformation characteristics of Au wire bonding

Cited by 13 publications

References 9 publications

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

Some thoughts on bondability and strength of gold wire bonding

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